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To: Vattila who wrote (16091)6/1/2016 8:00:40 PM
From: THE WATSONYOUTHRead Replies (1) | Respond to of 72355
 
AMD seems to have returned to a small die strategy to optimize cost and provide scalability. Going forward, I expect the high-end products will be multi-die solutions combined on interposer with HBM. No more huge die.

That's how it adds up for me too......and I know nothing about graphic cards...... seems like the right strategy.............two different mainstream cards at great price points and then two more enthusiast cards for the high end making selective use of HBM and multi die. Of course, it would have been nice to all launch at once but sometimes reality doesn't allow it. Papermaster specifically said they will compete in the ENTIRE graphic stack with various iterations of Polaris. These are just the first two. As Lisa said ..."You haven't seen anything yet" What does fpg think?......how does their plan sound ?.........Seems like they executed well on the mainstream part. For the first time, I read part of a gamer enthusiast board at HardOCP. What a near total bunch of WACKOS. You just can't imagine some of their "theories".



To: Vattila who wrote (16091)6/1/2016 8:02:09 PM
From: gzubeckRespond to of 72355
 
you cannot cut your way into profitability. gaining market share will not help unless its like 20% more. making it up in volume is a fiction they will sell as theyre walking out the door. my guess is that these 480s are the bottom feeder cards they want to get rid of first. the 480x the oems are probably eating those up by the wheelbarrow as amd continues to try to worm its way into every oem. why invent your own crap when amd will supply it at 20% less than what it would take you to invent it.



To: Vattila who wrote (16091)6/1/2016 8:11:21 PM
From: neolibRead Replies (3) | Respond to of 72355
 

AMD seems to have returned to a small die strategy to optimize cost and provide scalability. Going forward, I expect the high-end products will be multi-die solutions combined on interposer with HBM. No more huge die.


That would seem to imply yield problems at GF.