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Non-Tech : Kirk's Market Thoughts -- Ignore unavailable to you. Want to Upgrade?


To: Gottfried who wrote (4715)4/14/2017 10:07:33 AM
From: Kirk ©1 Recommendation

Recommended By
Gottfried

  Read Replies (1) | Respond to of 26710
 
TSMC cuts foundry growth outlook for 2017

Bits + chips | Apr 14, 12:14

TSMC cuts foundry growth outlook for 2017
Taiwan Semiconductor Manufacturing Company (TSMC) has revised downward its forecast for 2017 global foundry growth to 5% from 7% due to elevated inventory in the supply chain.

TSMC's less-optimistic revenue outlook for the second quarter reflects "a quite severe inventory adjustment by our customers, particularly in smartphone and PC markets," said company co-CEO Mark Liu at an April 13 investors meeting. TSMC expects to post a 8-9% sequential decrease in consolidated revenues for the second quarter of 2017.

TSMC has raised its overall IC market outlook for 2017, however. A stonger memory market will lead to a 7% rise in the global 2017 market for ICs, Liu indicated. Excluding memory, the overall chip sector will see a smaller 4% increase, Liu said.

Nevertheless, TSMC's target of a 5-10% increase in 2017 sales remains unchanged, according to Liu.

In addition, TSMC disclosed it will be ramping up production of 10nm chips "very fast" in the second half of 2017, company co-CEO CC Wei noted. The newer node technology will account for about 10% of TSMC's total wafer revenues in 2017, Wei said.

As for TSMC's 7nm process technology, more than 30 customers are actively engaged with TSMC on the process, and the foundry expects to have 15 customer tape-outs in 2017, Wei indicated. TSMC is scheduled to move its 7nm process technology dubbed N7 risk production later in the second quarter of 2017, followed by volume production in 2018, according to Wei.

Wei added more than half of the customer product tape-outs with TSMC's 7nm are HPC products. HPC will become TSMC's major growth engine starting 2020, Wei indicated.

TSMC also plans to introduce an improved version of its 7nm process technology dubbed N7 Plus in just one year after its N7 launch, Wei said. The N7 Plus will adopt extreme ultraviolet (EUV) lithography technology.

TSMC will fully implement EUV to make 5nm chips. The foundry has been working with its major clients to define 5nm specs and to develop technology to support them, Wei indicated. TSMC expects to move its 5nm process technology dubbed N5 to volume production in 2020, Wei said.

In addition, Wei talked about TSMC's 12nm process technology, which provides its mobile chip customers better cost structure to develop solutions for entry-level and mid-range devices. More than 10 customers have been actively engaged with seven tape-outs being planned in 2017, Wei disclosed.

TSMC will also roll out a 12nm Ultra Low Power (12ULP) node to target IoT applications, Wei added. TSMC also introduced 22ULP, a half node of its 28nm technology, which has been developed for applications requiring lower operating voltage. TSMC expects to begin 22ULP volume production in 2018, according to Wei.




To: Gottfried who wrote (4715)4/22/2017 1:43:42 PM
From: Kirk ©2 Recommendations

Recommended By
3bar
Gottfried

  Respond to of 26710
 
Incredible Y/Y growth!

North American Semiconductor Equipment Industry Posts March 2017 Billings
From semi.org

MILPITAS, Calif. — April 20, 2017 — North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in March 2017 (three-month average basis), according to the March Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

SEMI reports that the three-month average of worldwide billings of North American equipment manufacturers in March 2017 was $2.03 billion. The billings figure is 2.6 percent higher than the final February 2017 level of $1.97 billion, and is 69.2 percent higher than the March 2016 billings level of $1.20 billion.

“March billings reached robust levels not seen since March 2001," said Dan Tracy, senior director, Industry Research and Statistics, SEMI. “The equipment industry is clearly benefiting from the latest semiconductor investment cycle.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.



Billings
(3-mo. avg)

Year-Over-Year

October 2016

$1,630.4

20.0%

November 2016

$1,613.3

25.2%

December 2016

$1,869.8

38.5%

January 2017

$1,859.4

52.3%

February 2017 (final)

$1,974.0

63.9%

March 2017 (prelim)

$2,026.2

69.2%



Source: SEMI ( www.semi.org), April 2017

SEMI ceased publishing the monthly North America Book-to-Bill report in January 2017. SEMI will continue publish a monthly North American Billings report and issue the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. Beginning with the January 2017 WWSEMS report, bookings information will only be available for the back-end equipment segments of the industry. In addition, SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects nearly 2,000 member companies and 250,000 professionals worldwide annually to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

Association Contact

Deborah Geiger/SEMI
Phone: 1.408.943.7988
Email: dgeiger@semi.org

Notes

Next SEMI Billings report: May 23, 2017 at 3:00pm Pacific.

For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp



To: Gottfried who wrote (4715)6/21/2017 11:53:16 PM
From: Kirk ©  Read Replies (2) | Respond to of 26710
 
Are you still doing charts of this SEMI data?

I remember the days everyone waited for this report and it was such a big deal.... now most yawn... (not me!)

semi.org

North American Semiconductor Equipment Industry Posts May 2017 Billings

MILPITAS, Calif. — June 15, 2017 — North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in May 2017 (three-month average basis), according to the May Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

SEMI reports that the three-month average of worldwide billings of North American equipment manufacturers in May 2017 was $2.27 billion. The billings figure is 6.4 percent higher than the final April 2017 level of $2.14 billion, and is 41.9 percent higher than the May 2016 billings level of $1.60 billion.

“Semiconductor equipment billings for North American headquartered equipment manufacturers increased for the fourth month in a row and are 42 percent higher than the same month last year," said Ajit Manocha, president and CEO of SEMI. “The strength of this cycle continues to be driven by Memory and Foundry manufacturers as the industry invests in 3D NAND and other leading-edge technologies."

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.



Billings
(3-mo. avg)

Year-Over-Year

December 2016

$1,869.8

38.5%

January 2017

$1,859.4

52.3%

February 2017

$1,974.0

63.9%

March 2017

$2,079.7

73.7%

April 2017 (final)

$2,136.4

46.3%

May 2017 (prelim)

$2,273.0

41.9%



Source: SEMI ( www.semi.org), June 2017


SEMI ceased publishing the monthly North America Book-to-Bill report in January 2017. SEMI will continue publish a monthly North American Billings report and issue the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects nearly 2,000 member companies and 250,000 professionals worldwide annually to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

Association Contact

Deborah Geiger/SEMI
Phone: 1.408.943.7988
Email: dgeiger@semi.org

Notes

Next SEMI Billings report has been rescheduled to July 25, 2017 at 3:00pm Pacific

For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp