To: Sun Tzu who wrote (11283 ) 5/14/2021 11:14:02 AM From: Kirk © 1 RecommendationRecommended By Sun Tzu
Respond to of 26766 I recommend reading the web sites of the two companies to see for yourself what they make, etc. Also, II-VI is still integrating Finisar and should acquire COHR soon so you have to dig into all those too to get a full picture. I'm not sure how this affects II-VI since they just got a huge grant from Apple for VCSELs but the writer calls out Lumentum by name.Apple reportedly to sharply cut VCSEL die size for 3D sensors Julian Ho, Taipei; Willis Ke, DIGITIMES Friday 14 May 2021 Apple reportedly has decided to scale down the die size by 40-50% for VCSEL chips used in 3D face ID sensors for new iPhone and iPad devices to be rolled out later in 2021, a move that will help the vendor sharply cut production cost but may reduce total wafer output for such chips, according to industry sources. The sharp shrinkage in VCSEL die size means that one 6-inch GaAs epi-wafer can generate more such chips than before, and therefore total wafer output for the component will drop as shipments of mobile devices with 3D sensors are not expected to grow significantly, the sources said. As the leading supplier of VCSEL chips for Apple devices, US-based Lumentum recently has warned that the global 3D sensor market is likely to fall 20% in the next fiscal year, the sources continued. Shipments of VCSEL chips for both 3D sensors and ToF LiDAR scanners will continue to be mainly absorbed by Apple devices in the short term as Android-camp vendors have yet to show clear willingness to resume adoption of similar sensing solutions, the sources said. Win Semiconductors, reportedly the sole VCSEL foundry partner for Lumentum, declined to comment on specific clients or orders. But it noted that redesign of VCSEL chips could integrate more new functions and raise the threshold for other competitors.digitimes.com