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Technology Stocks : Qualcomm Moderated Thread - please read rules before posting -- Ignore unavailable to you. Want to Upgrade?


To: waitwatchwander who wrote (195420)8/26/2025 10:20:17 PM
From: engineer1 Recommendation

Recommended By
sbfm

  Respond to of 197001
 
no idea and who knows. It is slightly is easier to flow into vias, but has alot of issues with purity.



To: waitwatchwander who wrote (195420)8/26/2025 10:21:45 PM
From: Wildbiftek1 Recommendation

Recommended By
sbfm

  Read Replies (1) | Respond to of 197001
 
Not unique to Intel

fuse.wikichip.org

The transistor profile has been enhanced as well. Like Intel, TSMC introduced cobalt fill at the trench contact, replacing the tungsten contact. This has the effect of reducing the resistance at that area by 50%.