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To: Joe NYC who wrote (49850)	3/6/1998 12:14:00 AM
From: Paul Engel	Read Replies (1) \| Respond to of 186894

Jozef - Re: "what's the heat dissipation of the 333 MHz Deschutes?" I don't have that number, but I do have the heat dissipation for the 450 MHz Deschutes - 19 watts MAXIMUM - less than the M2 at 233 MHz. For reference, the Deschutes running at 266 Mhz at 1.6 volts dissipates a worst case 7.2 watts, and a "typical" 4 watts. I think the M2 is showing its age. By the way, the 35 watts for the Pentium II 233 MHz (0.35 micron) includes the power dissipation of the L2 SRAM - 512 Kbytes. A fair comparison to the M2 would subtract out that extra heat but I don't know what that number is. Paul

To: Joe NYC who wrote (49850)	3/6/1998 11:25:00 AM
From: John Donahoe	Read Replies (1) \| Respond to of 186894

Power Dissipation is a factor in determining a chips reliability. However it's not the only one. The most important factor affecting a chip's reliability is its internal temperature which is a function of mechanical issues (i.e. packaging and heatsinking) in addition to chip power dissipation. I'm assuming they are comparing apples with apples (i.e. all running at the same supply voltage). However there may be differences in the size of the CPU's package and the CPU's thermal mounting plate which could result in differences in thermal resistance which has a direct effect on internal temperatures. Without understanding the details to each companies approach to thermal management it's hard to determine the affect on reliability. Best way is to perform reliability tests. Accelerated life tests on a sample set of CPUs running in their intended thermal/mechanical environment would be very interesting. JD PS: Someone mentioned Cyrix applying thermal "goop" to their CPU's. This sounds very klugy. It normally indicates problems in heat sinking. "Goop" over comes irregularities in a device's thermal mounting plate's (TMP) flatness. A TMP should be as uniformally flat as possible to insure good contact with the heatsink thus reducing thermal resistance.