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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: John Donahoe who wrote (49895)	3/6/1998 12:58:00 PM
From: mikey	Read Replies (1) \| Respond to of 186894

I would like to let you know that every device that has a heat sink attached to it has some type of thermal "goop" used in between the parts. the reason is that metal to metal contact is not a very efficient(SP) heat conductor. Even Intel uses the stuff. from a personal stand point I use thermal "goop" where ever there is heat transfer, be it my P5 166(going 200) or a pnp transistor in my kids toy, to a power transistors in my home built UPS. thanks for listen(reading?) mikey