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To: Paul Engel who wrote (5122)	3/20/1998 11:53:00 PM
From: Maxwell	Read Replies (2) \| Respond to of 6843

Thank you for your information and Yousef's post. "C4 technology is used PLUS conventional AL bonding pads." This is a very smart strategy. It is very good for debugging process and at the same time ramping up C4 process. The only disadvantage is that Intel has to get and qualify another reticle without the bonding pads when they are up to speed with C4. With 5 metal layer and C4 process it really takes a bite out of the cycle time of manufacturing. Intel's PII process is now just as long to make as K6. I would willing to say the cycle time is similar. AMD gets more dice/wafer on the K6. Intel gets higher speed distribution per wafer. Intel gets higher ASP. AMD gets lower ASP but with more dice. Thus revenue per wafer for AMD and INTC is about the same. For AMD to make the same revenue per wafer as Intel, AMD would make alot of money. I see AMD at 50s soon. Maxwell