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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Yousef who wrote (31666)	4/10/1998 7:09:00 AM
From: Maxwell	Read Replies (2) \| Respond to of 1573427

Yousef: <<Believe me, AMD has put much/all of their process engineering resources on solving these problems ... I wonder who was working on their next generation .18um process. Probably no one !!>> I guess this implies that you are working on the 0.18um process. So tell me something about your 0.18um process. 1) What is your gate oxide thickness? 2) What is your drawn gate dimension? 3) What silicide you will use on your polygate? 4) What is the diameter of your contacts? 5) What oxide or fills you are using to fill your metal gaps? 6) Are you using low K stuffs or just conventional oxide? 7) Are you still using tungsten plugs? 8) How are you going to put down the seed layer (TiN) for tungsten, PVD or CVD? 9) Using aluminum or copper? 10) What is your metal 1 and metal 2 linewidths and pitches? 11) How many metal layers you will use for your 0.18um process? 12) Are you going to use 0.18um ArF steppers, old 0.25um KrF steppers, or obsolete Hg bulb SVGI scanners? 13) Lastly, what is the die size of the product that you will use this 0.18um process for? Hopefully it is not the 200mm^2 Merced because it ain't going to yield too well. Maxwell