SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?


To: andy kelly who wrote (54077)4/21/1998 8:55:00 PM
From: Yousef  Respond to of 186894
 
Andy,

Re: " Could the equipment they cancelled be 0.25 stuff that they won't need
now because 0.18 is coming faster than they expected? Does this make sense?"

I don't think this makes sense ... Intel has known and planned for the
mid-'99 release of their .18um process for some time. This isn't a
surprise to them ... maybe just a surprise to the media. My guess is
that the yields have been very/exceptionally good on .25um and thus
more capacity might not be needed.

Yousef



To: andy kelly who wrote (54077)4/21/1998 11:25:00 PM
From: Chris  Read Replies (1) | Respond to of 186894
 
Andy, RE: Intel's push to 0.18

"We're looking to ramp up 0.18-micron technology in mid-1999 to minimize the amount of 0.25-micron [production technology] we have put in place,"

Barrett seems be implying just that. They may have decided to leapfrog the competition... 0.18 would do just that.... I know of no one who is planning full production of a 0.18 fax by mid-99.

Intel pushes advanced production, 500-MHz chips

Link
news.com



To: andy kelly who wrote (54077)4/22/1998 12:50:00 AM
From: Paul Engel  Read Replies (2) | Respond to of 186894
 
Andy - Re: "Could the equipment they cancelled be 0.25 stuff that they won't need now because 0.18 is coming faster than they expected? Does this make sense?"

As far as Fab 16 (Fort Worth), yes - it will not be built and no equipment will be ordered until year 2000/2001 - and that may not even be 0.18 micron stuff - but 300 mm and 0.13 micron equipment.

Some of the equipment that was cancelled was assembly equipment - wire bonders from K & S.

Intel will be ramping their flip-chip/C4 bonding process, using entirely different equipment - no wire bonders required. The main vendor for this is not currently K & S.

Paul