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To: Time Traveler who wrote (6095)	5/12/1998 4:56:00 PM
From: Pravin Kamdar	Read Replies (1) \| Respond to of 6843

Time Traveler, re: The die size of the IC thus determines the power dissipation capability. The bigger the die size, the more heat it can channel into the substrate, then to the case, then to the heatsink, then to the ambient (assuming no bottlenecks). Does it not the bigger the cross section of a pipe the more water (per unit time) it allows to flow through? Think of heat as water and power as the flow rate of water. The point that you are missing is that for a larger die, with more transistors, MORE HEAT IS BEING GENERATED! The average power being dissipated per unit area goes up with higher density, while the heat dissipative ability of the die per unit area remains the same. In fact, this is one of the biggest problems going forward. Please don't show the last several posts to your boss. ;-) Concerning the the 16:9 aspect ratio, it would be great for viewing DVD movies on your PC, viewing three pages of text side-by-side, or viewing really wide spread sheets. Personally, for PC use I wouldn't get 16x9 unless you could rotate it sideways for viewing long web pages or erotic pictures posted on news groups. Pravin. PS: You mean to say the on resistance of the channel, not the "junction". Also, I'm glad that you are familiar with the equation that you posted. The point is that the voltage can only be lowered to the extent that the amount of current required for switching can be forced through the resistance in its path at that voltage. Be the electron.