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To: Scumbria who wrote (27637)6/25/1998 11:02:00 PM
From: kash johal  Read Replies (2) | Respond to of 33344
 
It depends where the problem can be fixed.

If it's a minor flaw (as it seems to be) it could easily be fixed by changes in final metal layers therefore they can use most of their current wafers in process.

This is most likely the case, so delay might only be 2-3 weeks. Of course product that is already metallized and in packaging will still be scrap.

Kash


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