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Technology Stocks : Qualcomm Incorporated (QCOM) -- Ignore unavailable to you. Want to Upgrade?

To: Sawtooth who wrote (12043)	7/5/1998 10:52:00 AM
From: Jon Koplik	Respond to of 152472

To all - just to start off the day -- some of you may not be aware that the CBOE will consider adding a new strike price of an option in response to a "mere mortal" out here contacting them and expressing an interest. The Qualcomm Jan 2000 $90 calls (and puts) are there only because I personally requested them several months ago. (They added them just one day after I inquired). (They just ask the market makers if they would be willing to make markets in another strike price). I have not personally transacted a single Jan 2000 $90 LEAP yet, but, clearly some other people have. (I wanted them there for possible future use). I have a feeling that if the 100's, 110's, 120's, etc. were all requested, we would soon find out at what point the market makers decide that this is just stupid and a waste of their time. Jon.

To: Sawtooth who wrote (12043)	7/5/1998 12:46:00 PM
From: Ramsey Su	Read Replies (3) \| Respond to of 152472

Is this news? Ramsey SAN DIEGO, CALIFORNIA, U.S.A., 1998 JUL 2 (NB) -- By Sylvia Dennis, Newsbytes. Qualcomm [NASDAQ:QCOM] has taken the wraps off the industry's first integrated trimode vocoder mobile station modem, a device that supports Enhanced Variable Rate Vocoder (EVRC) transmissions. According to company officials, the electronics chipset is designed to be used as a component of CDMA (Code Division Multiple Access) mobile handsets, and supports all three CDMA vocoder systems: eight kilobits Qualcomm Code Excited Linear Prediction (QCELP), 13 kilobits QCELP, and Evrc technology. The availability of the trimode vocoder, the company says, will allow mobile phone manufacturers to produce handsets that will work on different networks and, in the longer run, where roaming facilities exist, allow CDMA phone users to roam freely between national and even international networks. The electronics module is known as the MSM2310 and, thanks to its small size, Qualcomm predicts that CDMA handsets will start to get smaller, as well as offering multi network support. The company says it expects to see regular CDMA handsets dropping in weight to just four ounces (100 grams) when the electronics are used efficiently. Donald Schrock, Qualcomm's ASIC (application specific integrated circuit) division president, said that the company is responding to its customers' needs with the new module. In early carrier testing of the MSM2310, he said, superior results and performance were seen. Newsbytes notes that the MSM2310 is built upon Qualcomm's fourth generation MSM2300 architecture, as used in worldwide CDMA phone production. This includes proprietary CDMA building blocks, a microprocessor and several DSP (digital signal processor) cores integrated onto a single chip. Production quantities of the MSM2310 are now available in two sizes, the 196 ball plastic ball grid array (PBGA) package and a 176-pin thin quad flat pack (TQFP) package. The 196-ball PBGA packages have a high lead count per area, and unlike (TQFP), require no additional board space for lead extensions outside the package body, the company says.