To: JBoyd who wrote (34307 ) 7/11/1998 6:28:00 PM From: Maxwell Read Replies (3) | Respond to of 1572033
JBoyd: <<I'M DESPERATELY LOOKING FOR EXCUSES TO HOLD THIS STOCK!!!>> Hold on to the stock. This stock is pretty much bottom out. I will get to the details a little later. <<Do you think that AMD has some (very few I'm sure) competitive advantages over Intel at this time. Is AMD losing more ground? Will they have a product to sell when Dresden is completed?>> AMD does have competitive advantage over Intel. Here are some 1) K6/K6-2/K6-3 die size at 0.25um are all SMALLER than Intel 0.25um PII. Smaller silicon are means cheaper to manufacture if the yield is good. 2) K6-2-300MHz can do 1.2GFLOPs FPU versus PII-300MHz of 0.3 GFLOPs of FPU. This shows up when you play games such as QuakeII with 3DNow drivers. K6-2-300 will beat PII-300 when softwares are written to access K6 3D engine. 3DNow is the FUTURE and Intel is behind. 3) K6-2 is selling cheaper than PII. 4) AMD GETS MORE dice per wafer than Intel gets with their PII. 5) Cost of manufacturing of socket 7 chip is cheaper than slot 1. <<K-6 design. You indicated that it was a great design, but they were overly aggressive in implementation. Yousef made the same point and says AMD is two to three years behind Intel in process technology. Is process technology basically manufacturing or is it design? I'm really struggling to understand this aspect of the business. >> Don't listen to Yousef. He doesn't know what he is talking about. His process knowledge is limited. He understand little of IC design and none on semiconductor business. For your information, IBM/AMD process is the best and most aggressive in the industry today. With local interconnect AMD is able to shrink the chip smaller that what Intel could achieve. The K6-2 with integrated 256KB cache has 21.3M transistors with only 117 sq. mm in die size on 0.25um process whereas the PII on 0.25um has 7.5M transistors with die size 131sq. mm! Smaller die means you can put more functionality on a chip without sacrificing the yield and this is a COMPETITIVE ADVANTAGE. Intel is more conservative in their design because they want their chips to be MORE MANUFACTURABLE. This in turns lose out on the competitive advantage which results in a LARGE DIE SIZE. Yousef only premise is that "because Intel achieves higher clock speed Intel has a superior process". This is a fallacy. Higher clock speed comes with design for a given process. There is only so much you can do with process and the rest must rely on design. Digital is able to achieve 550MHz on 0.35um while Intel can only squeeze out 300MHz. Is it because Digital has superior design? None at all. Digital has better IC design. AMD gambled on a complicated process to get the competitive advantage. The gamble so far has really paid off. Not only did they mastered the local interconnect, bumps, and 5 metal layers they get great yield. AMD is penetrating the market with the K6-2 very well. It is a two thumbs up product. This is one unique product that Intel cannot block. The reason is that Intel HAS NO 3D CPU! By Christmas 3DNow should be written in stone. What about AMD making money? Watch for Q3 and Q4. AMD should be making money. The reason their fixed cost is so high is that they are building Fab30. This drains their cash. By Q3 and Q4 their sales should outpace their cost and investment. AMD needs Fab30 to compete. It takes a critical mass to effectively compete against Intel. The future for AMD is much brighter than the K5 days when the stock was at $13. Back then AMD didn't have a future. Now AMD has a whole line of products come down the pipeline such as K6-3 and K7. There are customers (CPQ, HWP, Acer, IBM, GTW, Toshiba, NEC, Packard Bell, CTX, Polywell, etc.) want AMD parts and they want AMD to succeed. Maxwell