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To: SemiBull who wrote (6351)7/23/1998 2:07:00 AM
From: Q.  Read Replies (3) | Respond to of 10921
 
re. <<My research to date still supports the point that SMTL makes the better plating tool...>>

In the NVLS conf. call, Rick Hill was asked what competition he faces in copper. He first discussed AMAT, which to me suggests this is what he is most mindful of for the future. Then he mentioned SMTL, where he said that NVLS had won account(s) away from SMTL, citing differences in the product offering.

Of course, mgmt. statements should not always be taken at face value, but I don't see any evidence in the recent offerings that NVLS didn't take IBM away from SMTL.

Judging from the various news releases, I would guess that IBM has done quite a lot of research, in head to head comparisons of the two, in deciding which is the better plating tool.