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To: lucky_limey who wrote (61671)	8/2/1998 1:10:00 PM
From: Gary Ng	Read Replies (1) \| Respond to of 186894

hugh, Re: Where is the R&D monies going? To places that can generate huge profit. State of the Art production technologies might not mean profit. Gary

To: lucky_limey who wrote (61671)	8/2/1998 1:18:00 PM
From: Paul Engel	Respond to of 186894

Hugh - Re: IBM, SOI and copper - " ...introduce a 1-GHz PowerPC 750 chip in the first half of next year-well ahead of its closest rivals. " Hmmm...last year the big story was that IBM was going to introduce 1 GHz Power PCs just using their copper technology. Now they have to combine copper with SOI to get to 1 GHz? I can't wait to see what new technology they come up with next year to get to 1 GHz. Paul

To: lucky_limey who wrote (61671)	8/2/1998 11:40:00 PM
From: Bill Jackson	Respond to of 186894

Hugh, I suspect Intel is quietly at work on these processes. The SOI has long been used with sapphire and diamond as the insulating substrate in many military ICs allowing high speed, rad hard and other attributes to be acquired. I wonder if the new plasma deposited diamond films are the base for this technique. Diamond polycrystalline films can now be deposited on may substrates from plasma and have higher thermal conductivity. This conductivity is however, anisotropic and requires a certain axial orientation of the diamond to optimize this. Whether or not thermal conduction will be extremely high with polycrystalline diamond I do not know? Perhaps it will be good enough and it is an insulator if so desired. Perhaps the tech will know these answers? For high end chips the cost can be justified. Bill