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Technology Stocks : Teradyne -- Ignore unavailable to you. Want to Upgrade?

To: Mason Barge who wrote (813)	8/27/1998 9:03:00 PM
From: Demosthenes	Respond to of 1184

Mason, Good points. And I hope your right about steppers as I have a large position. Rgds, D

To: Mason Barge who wrote (813)	8/27/1998 9:39:00 PM
From: Sleeperz	Read Replies (1) \| Respond to of 1184

Fujitsu's Super CSP can be tested in wafer form By Yoshiko Hara TOKYO - Reversing the conventional fab sequence, a Fujitsu Ltd. scheme packages all the devices on a wafer before dicing them into separate chips. The so-called "wafer molding" technique, demonstrated here last week, enables processing in one batch, from fabrication to assembly, Fujitsu said, and permits testing in wafer form. eet.com