SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : The New QLogic (ANCR) -- Ignore unavailable to you. Want to Upgrade?


To: Craig Stevenson who wrote (18620)10/15/1998 8:26:00 AM
From: Neil S  Read Replies (1) | Respond to of 29386
 
Craig, More on Computing Fabrics from PC Week:

Researchers predict lots of cheap computing power is on the way

zdnet.com

Computing Fabrics to refashion industry

zdnet.com

The technologies of Computing Fabrics

zdnet.com

Computing Fabrics still have some holes, PC Week Labs finds

zdnet.com

<<SANs (storage area networks) would be a critical component of Computing Fabrics. These networks, based on a combination of Fibre Channel technology and advanced storage devices, will greatly enhance performance and ease management of corporate data.>>

Neil




To: Craig Stevenson who wrote (18620)10/15/1998 11:37:00 AM
From: Greg Hull  Read Replies (2) | Respond to of 29386
 
Craig,

<<<<Is the Intel processor a power hog? Do the Ancor ASICs have cooling fins? If the MKII-8 dissipates 115W what fraction is not from the power supply? If not for the need to accommodate 8 GBICs, couldn't the PCB be quite small?>>

Unfortunately, I don't know where the majoritity of the power goes in the MKII. I don't recall seeing any heat sinks on the ASICs, or on the I960. If you didn't have the 8 GBICs you wouldn't be able to connect anything to the switch. <g>>>

Then the switch would be even smaller. No, my point, of course, was that I/O would consume a fair percentage of the board real estate. Just like die size is often limited by the bonding pads, the accommodation of the GBICs probably makes the PCB bigger than it would have to be. If the package weren't meant to be rack mounted, the GBICs would not have to be strung out on just one side of the board.

<<I could be wrong on this, but it appears as if the SilkWorm could be using a plastic case>>

This is interesting. If this is true, the market must not demand rugged packaging.

Thanks for your thoughts,
Greg

P.S. A sales/earnings contest this quarter would be quite interesting, with guesses all over the map. Will they recognize all or just part of the INRANGE funds? How much from Hucom? Will they even report a profit? Will they allow individual investors to participate in the conference call?