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To: Sun Tzu who wrote (192)10/27/1998 2:35:00 PM
From: rich evans  Read Replies (1) | Respond to of 10711
 
You obviously know more about the tech then I do. I worry about a sysytems on a chip where intel incorporates the 3d graphics on their chip with the larger chip sizes allowable with 12 inch wafers and higher densities with .18-.13 micron. I think INTC will start doing in silicon what MSFT does in their software incorporating more and more in their chips to get higher ASPs and make them more proprietary. I don't know. But in telecom the same problem exists for a Telllabs or Ciena etc. What if no crossconnects become necessary using WDM etc. If one stays on top of it all and can move and change as you suggest- fine. But what is one wants to enjoy the Idaho backcountry far away from the maddening crowd for the summer.
Rich

Rich