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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Paul V. who wrote (27547)	1/6/1999 9:34:00 AM
From: Duker	Respond to of 70976

Article on Cu ... A service of Semiconductor Business News, CMP Media Inc. Story posted 9 a.m. EST/6 a.m., 1/6/99 Copper tools set to take off By J. Robert Lineback SAN JOSE -- While semiconductor capital equipment suppliers continue to suffer through a severe slump, copper processing tools will be a shinning bright spot in an otherwise dismal market this year, according to a new 1999 forecast from VLSI Research Inc. Revenues for equipment used to produce copper interconnect on ICs will more than triple in 1999, growing to $199.2 million vs. $64.5 million in 1998, said the San Jose market research firm. Semiconductor spending on copper processing tools will jump to $1.7 billion worldwide in 2003, according to analyst Risto Puhakka, director of chip-making markets at VLSI Research. Copper technology is expected to overtake aluminum as the metal for connecting functions on ICs as feature sizes shrink below 0.18 micron. Copper wiring can potentially improve performance of devices by reducing resistance on interconnect lines. Most chip makers plan to eventually migrate to copper and new low-k dielectric insulators in a dual damascene process for interconnects in the next five years. IBM Corp. last year started the rush to copper interconnect by announcing it was ready to put the metal into volume production, but few commercial tools were ready until late in 1998. Novellus Systems Inc. has worked with IBM Microelectronics to commercialize copper deposition technology. Under its alliance with IBM, Novellus was not completely free to offer its technology on the market until the end of 1998. "We'll probably see copper deposition take off, especially since Novellus has the clearance from IBM to sell tools to other companies," Puhakka added. --Duker