SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Adaptec (ADPT) -- Ignore unavailable to you. Want to Upgrade?


To: Thai Chung who wrote (4258)1/13/1999 9:11:00 AM
From: w2j2  Respond to of 5944
 
HOUSTON--(BUSINESS WIRE)--Jan. 13, 1999--Four of the world's
leading technology companies today announced the formation of an open
industry alliance to set the direction of Future I/O technology
development and implementation.
The Future I/O alliance is creating a new input/output (I/O)
standard to maximize data transfer between high-performance servers
and peripheral subsystems for the next generation of high-performance
systems. The Future I/O standard builds on the decades of collective
knowledge and experience possessed by the high-performance computing
companies involved in the alliance. In addition, the combined server
marketshare of Compaq, Hewlett Packard and IBM will be a significant
factor in driving the openness and broad industry support for the
Future I/O standard.
Balancing I/O performance is crucial to improving overall system
performance and scalability. Future I/O technology has a number of key
advantages over existing bus designs and alternative solutions. The
areas of improvement include:

-- A specification allowing for continued innovation with the
standard to ensure that evolving customer needs are satisfied
-- Easier and more regular performance enhancements
-- Better fault tolerance and fault isolation, leading to
increases in overall system reliability, availability and
serviceability
-- More scalable and balanced systems
-- More cost effective and manageable I/O lowering overall system
cost

Future I/O employs "point-to-point" links that allow devices to
operate at their optimum performance and reliability levels. Unlike
existing bus technology that is difficult to upgrade because all
connected devices have to move in lock step, point-to-point
connections allow performance improvements to be painlessly deployed
within a defined development cycle--more rapidly than the lengthy 7 to
10 year cycle with existing bus technology.
Individual systems utilizing PCI, PCI-X and Future I/O devices
are expected to co-exist in the market for many years after the first
deployment of Future I/O systems in 2002. "There is a compelling need
to build on existing PCI and PCI-X systems and develop a new I/O
specification that can deliver scalable performance improvements,
while protecting the IT investments of customers," said Karl Walker
vice president of technology development at Compaq Computer
Corporation. "By bringing the market-leading server manufacturers
together in a unified effort, we have developed an open, best of breed
technology providing customers with a clear path for the future. We
designed the technology to be deployable across our entire spectrum of
business solutions from the Desktop to the Enterprise at a cost and
manageability level better than existing PCI solutions. The customer
will be the ultimate benefactor of this initiative."
"Our enterprise customers are running a variety of IT systems and
have substantial time, money and resources invested in their
technology," said Randy Groves, vice president of development for
IBM's Netfinity line of servers. "That's why the top server vendors
have joined together to craft the Future I/O standard -- to protect
our customers' investments and deliver the right technology when they
need it. Computing today is all about the customer and end-users, not
machines or engineering specs and we understand that better than
anybody."
"System vendors have a very close relationship with their
Enterprise customers. We see these customers, on many different
levels, on a daily basis. We are very aware of their needs involving
system performance, availability, reliability and scalability, and
their concerns involving investment protection," said Martin
Whittaker, research and development manager for enterprise NetServers
at Hewlett Packard. "Together the companies of the Future I/O
Initiative wanted to establish an open industry initiative that
recognizes the input from multiple vendors with reasonable and
non-discriminatory (RND) licensing terms that are very similar to
those in many other standards. The customer needs a standard that
allows innovation within a specification clear and complete enough to
ensure interoperability."
"It is a profound testimonial to the growing maturity of this
industry that market leaders can come together to cooperate on such an
important and far reaching initiative. We are seeing a strong
collaborative effort with each of the companies involved contributing
their best technology and welcome the long-term benefits it affords
our customers, " said Robert Selinger, vice president and chief
technologist for Adaptec.
The Future I/O Initiative builds on the success of the recently
announced PCI-X specification that was jointly developed by Compaq,
HP, and IBM. The Initiative will follow an open industry development
and governance model similar to that of the PCI Special Interest Group
(SIG) which is the governing body responsible for the open development
process that has successfully managed the PCI standard over its
lifetime.
"3Com, the leader in rolling out Gigabit Ethernet from the
network core to the client, is working with the Future I/O group to
ensure that the next generation of servers have high-performance,
highly-reliable channel architecture," said Tom Werner, vice president
and general manager of 3Com's LAN connectivity division. "Compaq,
Hewlett-Packard and IBM are experts in servers and have great market
experience. 3Com is delighted to join with these companies and bring
to bear our unmatched experience and expertise in networking."
"LSI Logic is very excited about participating with other leaders
of the enterprise server market to develop the next generation systems
interconnect, " said Harry Mason, Strategic Alliance Director at LSI
Logic. "It's clear that switched-based fabrics will enable new levels
of increased reliability, scalability, and manageability to provide
compelling customer benefit to the enterprise systems market. LSI
looks forward to applying its expertise in high performance storage
solutions, and leading edge System-on-a-Chip(R) custom components, in
the enablement of Future I/O technology."
There will be a conference to announce more details about Future
I/O on February 12th. Companies interested in joining in the Future
I/O Initiative and registering to attend the February conference are
encouraged to visit the Future I/O Initiative website at
www.futureio.org