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Technology Stocks : Kulicke and Soffa -- Ignore unavailable to you. Want to Upgrade?

To: FJB who wrote (3253)	3/16/1999 7:46:00 AM
From: James A. Chiafery	Read Replies (1) \| Respond to of 5482

NEWS For Immediate Release Company Contacts: Media: Henri Van Parys 215-784-6818 Analysts: Jim Chiafery 215-784-6436 K&S Signs New Customer For Automatic Wire Bonders Willow Grove, PA, March 16, 1999-ASAT, a multinational semiconductor assembly subcontractor, has placed an order with Kulicke & Soffa Industries (NASDAQ: KLIC) for Model 8020 automatic wire bonders and Model 7500 plus dicing systems. The order is valued at nearly $4 million. Shipments to ASAT's Hong Kong assembly facility will take place during the second and third quarters of fiscal year 1999. Although ASAT has been using K&S dicing equipment for several years, this is the first order the company has placed for K&S wire bonders. The bonders will be used to assemble ASAT's proprietary enhanced dissipation quad flat pack (EDQUAD) packages with pad pitches below 70 microns, as well as ball grid array (BGA) and tape ball grid array (TBGA) devices. The dicing systems will be used for BGA singulation after wire bonding and molding. "ASAT is committed to remain on the leading edge of IC performance, and Kulicke & Soffa's wire bonding equipment has demonstrated the ability to assist us in that regard," said ASAT General Manager Dean Personne. "The company has also worked closely with us in fine tuning our BGA singulation processes for improved yields." "We are pleased that ASAT has joined the growing list of subcontractors that have selected our automatic ball bonders," said K&S Vice President and General Manager Dave Leonhardt. "We believe that our IC ball bonder technology will continue to be the industry's choice for high end, fine pitch packaging solutions." Kulicke & Soffa is the world's largest supplier of semiconductor assembly equipment. The company serves the integrated circuit assembly market with a product line that includes wire bonding, die bonding and wafer dicing equipment, as well as packaging materials, including bonding wire, capillaries, wedges, die collets and saw blades, and has sales and service facilities worldwide. The company's web site address is www.kns.com. # # #

To: FJB who wrote (3253)	3/18/1999 12:12:00 AM
From: Gottfried	Respond to of 5482

RG/all, KLIC upgraded to BUY by Janney Montgomery... biz.yahoo.com Gottfried