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Technology Stocks : Superconductor Technologies : SCON -- Ignore unavailable to you. Want to Upgrade?

To: Wafa SHIHABI who wrote (216)	3/13/1999 3:00:00 PM
From: Mark Adams	Read Replies (1) \| Respond to of 903

Because they've managed to navigate the field trials, and generate initial sales, I hold a very small position. We are talking a whole 100 shares here. What I've seen happen to small companies is they have technology, sales and production capability, but can't ramp quickly enough to obtain breakeven before running out of working capital. So I have to ask, if their sales/quarter are in the two digit area, how are they going to obtain breakeven with their low utilization rate? What rate of production would push them beyond breakeven? These sound like your typical business plan questions. Probably the old chicken and egg thing. Volume sales can't happen unless they demonstrate production capabilities. But they also have to demonstrate financial viability. Cell Site operators don't want to install equipment from a company that might not be there two years hence to service it.

To: Wafa SHIHABI who wrote (216)	3/20/1999 11:53:00 PM
From: HerbVic	Respond to of 903

Put this in the FWIW semi-related department. Two inventions follow. My 2 one cent questions are, "Is this new or old news?" and "Does it have any application relative to SCON's manufacturing process?" — HerbVic From UT Austin "Technologies Available for Licensing" utexas.edu >>>>>>>>>>>>>>> UTSB 600 <<<<<<<<<<<<<<< Chemically Tailored Corrosion Resistant High-Tc Superconductor Thin Film Structures and Devices DESCRIPTION This invention relates to new formulations and methods of deposition of chemically stable (corrosion resistant) high-Tc superconductor thin film structures and devices. Operation would be at liquid nitrogen temperatures, as opposed to conventional superconductor operation at liquid helium temperatures - liquid nitrogen coolant is cheaper than helium and more easily utilized. New formulations of high temperature superconductors based on YBa2Cu3O7 have been identified which exhibit vastly improved processing characteristics. This invention relates to both new formulations of these superconductors as well as methods for their deposition in thin film form. Newly identified materials exhibit both excellent superconducting properties (i.e. high Tc and Jc) as well as excellent processability. These cation substituted materials are less prone to environmental degradation and oxygen surface loss and less subject to oxygen electromigration problems. Collectively, these enhanced materials characteristics make the new formulations attractive replacement candidates for the parent compound, YBa2Cu3O7. APPLICATION This invention may be useful in the preparation of the following types of circuits and devices: interconnects for hybrid semiconductor/superconductor circuits; digital Josephson technology; passive microwave devices; superconducting quantum interference devices; superconducting field effect transistors; high-Tc bolometers; and superconducting flux flow transformers. * Superconducting transition temperatures above 77 K (78 <Tc<92). * Jc comparable to YBa2Cu3O7 when changes in Tc are accounted for * 100 fold reduced environmental degradation rates relative to YBa2Cu3O7 * Reduced problems with galvanic corrosion near metal contact layers * Reduced problems with oxygen electromigration * Higher reproducibility for high-Tc devices >>>>>>>>>>>>>>> 95-010 MCD <<<<<<<<<<<<<<< Precise, Atomic Level Control of the Interfacial Properties of Superconductors through the Spontaneous Chemical Adsorption of Monolayer Film DESCRIPTION A new method has been invented for the spontaneous adsorption of monolayer films (composed of a certain class of molecules) onto the surfaces of superconductors. Previously, an effective method for the direct chemical attachment of molecular or polymeric layers to the surface of superconductors did not exist. The attached molecular or polymeric layers are of vital importance in determining the final interfacial properties of the superconductor structures and devices. With this invention, the surface-modification method is simple and easily reproducible using common lab equipment and reagents. The result is precise, atomic level control of the interfacial properties of high-Tc superconductor systems. Specifically, defect-free and anti-corrosion layers for both thin film and bulk ceramic high-Tc structures can be generated in a simple fashion. These layers can be used to extend the lifetimes of high-Tc structures. In addition, methods for lithographic processing of high-Tc devices can be improved and/or optimized, and the adhesion of protection layers for the use of packaging the superconductor structure can be improved. APPLICATION The new method may be used to fabricate superconductor devices, anti-corrosion layers, and adhesion layers.