hi alan, milehigh, and jman,
please, i am not frustrated, not at all.
i am elated at the prospects for rdram. i know that not a single computer has been sold with rambus rdram. after reading this, i think you will agree that is about to change. i have said repeatedly that i expect the big payout to be in 2002-2003. i am just in here now to capture the first 300-400 points of the rmbs run, before it really takes off.
i have given much thought to the remarks by jman and milehigh over the past few days. i went back and reread some of the current
(1999 only) info that is available. i found on the negative side a three month delay announcement. after reading the other stuff posted below, i decided that the delay is much ado about nothing. it does not frustrate me because the fundamentals for rmbs, which i like to keep focused on, keep getting stronger. my time frame for rmbs' huge success remains the same.... no, that is wrong! my 2002-2003 time frame is getting shorter and better.
remember that rambus is also the new memory for dvd, copiers, scanners, multi-function devices, hdtv, high speed telephone equip, nintendo 64, sony playstation, etc.
i do talk to rmbs ir from time to time they told me last week or two that everything is on track.
here is the info...enjoy the read. i printed it...thinking about framing it.
Schlumberger takes on RDRAM test challenge (3/17/99)
Testers in the company's RDX2200 series boast ±50-ps multisite edge-placement accuracy, a 1-Gbit/second data rate and new software that accommodates the RDRAM's requirements for packet-data generation
(2/22/99)
Hyundai Electronics today announced availability of its new 64 Mbit Rambus DRAM and its new 64 Mbit ECC (also known as 72 Mbit) Rambus DRAM (RDRAM®) product family. Designated the HYRD64E840/ HYRD72E840 Series, the new 0.22 micron-based RDRAM will be available in production quantities in mid 2Q '99.
(1/27/99)
Toshiba America Electronic Components, Inc. (TAEC) today announced another Rambus® technology leadership achievement with the delivery of its 64 megabyte (MB) and 128MB Revision B Rambus RIMM™ memory module samples to Intel.
remember toshiba is the world's largest laptop maker. a few days ago, they announced a $1 billion venture with sony to produce rdram.
(3/16/99)
NEC Electronics Inc., Santa Clara, Calif., will being shipping samples of a new 800MHz 128-megabit Direct Rambus dynamic random access memory (DRAM) device in April 1999.
(3/9/99)
Taiwan Semiconductor Manufacturing Corp. confirmed that it had 'informal' contact with
Intel Corp. about making an unspecified device for the chipmaker. Industry sources say a
deal between the two companies could involve TSMC making Direct Rambus DRAMs either for Intel or other memory makers.
(2/27/99)
Rambus Inc. announced a mobile version of its technology at the Intel Developers Forum
this week, and Intel executives said they expect the Rambus DRAMs to show up in notebook computers in mid-2000.
(2/22/99)
Hyundai Electronics will begin to ship commercial quantities of the Direct Rambus DRAMs in May, starting at 64-Mbit and 72-Mbit densities, and move into full volume production by July.
(2/22/99)
The field of organized initiatives pursuing alternatives to the Intel-backed Rambus DRAM has shrunk by one.
(2/12/99)
National Semiconductor Corp. has become the third major PC microprocessor vendor to license a high-speed DRAM interface from Rambus Inc., following Intel Corp. and Advanced Micro Devices Inc.
(2/11/99)
Looking to expand its efforts in the LAN space, Rambus Inc. has licensed its high-speed memory interface technology to SwitchCore Corp., a Swedish company that is developing a high-end, Layer 3-based switching chip for Fast Ethernet and 1-Gbit/s networks.
(2/10/99)
National Semiconductor Corporation® (NYSE:NSM) announced today it has licensed the Rambus® high-bandwidth 800 MHz memory interface for use in future integrated processors developed by its Cyrix subsidiary.
(2/2/99)
Hewlett-Packard Company and Rambus Inc. today announced that HP has licensed Rambus interface technology and intends to offer Rambus memory subsystems to a variety of HP system divisions.
(1/27/99)
Memory module maker Kingston Technology Co. is ramping RIMM module production, citing increasing demand for boards that support the new Direct Rambus DRAM specification.
(1/22/99)
Intel Corp. will invest $100 million in Samsung Electronics Co. to help accelerate the South Korean chip maker's production of Direct Rambus DRAMs.
(1/20/99)
UMC Group said it will offer its foundry services to controller-chip developers that utilize the Direct Rambus ASIC Cell (RAC) memory interface of Rambus Inc.
(1/20/99)
Samsung Electronics will use the proceeds from this investment and additional funds to invest in Direct RDRAM fabrication, assembly and test. Samsung is already shipping sample Direct RDRAM devices and is ready for volume production in second quarter of 1999.
PORTLAND, Ore., Feb. 26 /PRNewswire/ -- Electro Scientific Industries,
Inc. (Nasdaq: ESIO) announced an order for ESI's memory yield improvement Systems. The units will all be shipped during ESI's current quarter ending February 28, 1999 to Samsung in Kiheung, Korea. They will be used in the production of advanced DRAMS, including Rambus configurations
CAMARILLO, Calif.--(BUSINESS WIRE)--March 1, 1999--Leveraging its expertise in telecom and ATE IC product design, Vitesse Semiconductor Corporation (Nasdaq:VTSS) today introduced a family of clock multiplier and distribution ICs -- the VSC6108,
VSC6110, and VSC6112. This family provides precision clocks with 18 differential ECL outputs for high speed clock applications, such as computer clock distribution, RAMBUS telecom and ATE systems.
FREMONT, Calif.--(BUSINESS WIRE)--March 1, 1999--Unigen, a leader in the design and manufacture of memory products, announced the immediate availability of 32MB (16Mx16 or 16Mx18 ECC), 64MB (32Mx16 or 32x18 ECC) and 128MB (64Mx16 or 64x18 ECC) Rambus(tm) RIMM modules.
WEST CHESTER, Pa.--(BUSINESS WIRE)--March 1, 1999--Amkor Technology Inc. (Nasdaq:AMKR) the world's leading provider of packaging and test services for the semiconductor industry, today announced plans to double production capacity of its uBGA(R) chip-scale (CSP) packages by mid-1999.
Amkor delivered more than 14 million uBGA packages since the state-of-the-art package was introduced last year. Under current plans, the production capacity will be increased to 6.0 million units per month.
With their very low profile and size, uBGA packages were specifically developed to meet the needs of IC suppliers and OEMs who require near chip-size packages for use in next generation cell phones, personal digital assistants and laptop computers. uBGA technology is also used in packaging Rambus(R) DRAMs (RDRAM(R)).
TOKYO--(BUSINESS WIRE)--March 2, 1999--Sony Computer
Entertainment Tuesday announced the completion of its research
and development project to design the successor to the PlayStation(R)
that was first introduced during 1994 in Japan. .........
NEXT GENERATION PLAYSTATION(R) BASIC SPECIFICATION AND
FEATURES
CPU 128 Bit "Emotion Engine(tm)"
System Clock Frequency 300 MHz
Cache Memory Instruction: 16KB, Data:
8KB + 16KB (ScrP)
Main Memory Direct Rambus (Direct RDRAM)
PALO ALTO, Calif.--(BUSINESS WIRE)--March 4, 1999--
Conference Technical Programs to Spotlight High-speed Digital,
RF, Memory, Systems-on-chip, Parametric Test and Other Test Technologies
Hewlett-Packard Company's Measurement Organization today
announced it will hold its second annual semiconductor user group
conference in San Diego, April 5 through 7. This year's conference will feature six technical tracks covering the following topics:
- effective use of the HP 83000 high-speed digital IC test system
for applications including multimedia system-on-a-chip, embedded
memory, and RAMBUS interface testing;
OTTAWA--(BUSINESS WIRE)--March 5, 1999--Semiconductor Insights, a
world-leading microelectronics consulting firm, today announced a new facility for providing high level Competitive Analysis and Intellectual Property services to the semiconductor industry. In an effort to help its clients in the determination of patent
infringement and performance evaluation of competitors' devices, Semiconductor Insights is now offering Electron Beam Analysis (EBA) as part of its consulting package.
"The goal of our consulting services is to work with our clients to develop their technology strategy," said Derek Nuhn, Semiconductor Insight's Vice President of Sales and Marketing. "With the investigations we are currently performing on the new 256M,
DDR, Rambus and embedded DRAMs from manufacturers such as Samsung and Micron,
EBA provides additional insight into the operation of state-of-the-art devices." Investigations of the new sub 2.0 V flash devices from Intel and AMD are also pending.
PARSIPPANY, N.J., March 8 /PRNewswire/ -- PNY Technologies, Inc., a global leader in the design, manufacture and distribution of memory and CPU upgrade products, announced today the signing of a partnership agreement with RAMBUS, Inc. to design, manufacture, and sell Direct RAMBUS memory modules, or RIMM's.
SAN JOSE, Calif.--(BUSINESS WIRE)--March 9, 1999--Leveraging unmatched industry knowledge, technology leadership, management services and global resources, Schlumberger Automated Test Equipment (ATE) has demonstrated that it is the only company capable of providing a total test solution for memory manufacturers'
unprecedented ramp to high-volume production of RDRAM(R) devices.
SAN JOSE, Calif.--(BUSINESS WIRE)--March 9, 1999--
New RDRAM Services Help Memory Manufacturers Achieve Fastest Possible Time-to-Volume and Profitability
Schlumberger Advanced Business Engineering Resources (SABER(SM)), a business unit that provides comprehensive operational and business management services to help organizations optimize profits, today announced that it has begun offering services for RDRAM(R) technology. Designed to assist memory manufacturers to successfully ramp production of RDRAM devices and achieve the fastest possible time-to-volume while increasing profitability, SABER services for RDRAM technology include design validation, device characterization and production.
SANTA CLARA, Calif., March 15 (Reuters) - NEC Electronics Inc. on Monday said it will add a 128-megabit dynamic random access memory (DRAM) microchip from RambusInc <RMBS.O> to its line of advanced memory chip technologies.
NEC said it expects to begin issuing samples of the chip, called the Direct Rambus DRAM, in April to manufacturers of high-end workstation and desktop systems at a price
of $85 per unit. Volume production is expected by July.
RANCHO SANTA MARGARITA, Calif.--(BUSINESS WIRE)--March 16, 1999--
Viking Components, one of the world's largest manufacturers of computer memory, flash and modem products, Tuesday announced the ability to test DDR SDRAM and Rambus RIMM memory modules using the Advantest T5591 platform.
RED HERRING VENTURE MARKET SOUTH, ATLANTA, March 17 /PRNewswire/
-- Orologic, Inc. is a startup enterprise positioning itself to become a leading supplier of system-on-a-chip solutions for Wide Area Networks (WAN) and enterprise backbone network switching solutions. Orologic's integrated circuits are designed to help switch
vendors address their customers' requirements in a timely and cost-effective manner. The Company is based in Research Triangle Park, North Carolina.
Orologic solutions feature several high-speed WAN market "firsts," including an AAL-5 SAR, Guaranteed Frame Rate service, carrier-class OAM capabilities, protection switching, dual leaky bucket policing, dual leaky bucket shaping, a multi-layer decoder/forwarding engine, and interworking functions all operating at wire speeds of 2.4
Gbps (full duplex). Additionally, Orologic is the first to implement the optimum Earliest Deadline First (EDF) scheduler, which allows switch suppliers to provide individual rate and delay (QoS) guarantees to up to 256K individual sessions with per- session queueing. Packet memory with up to 1 million buffers and a large portion of the session control memory are implemented in RDRAM using two Rambus interfaces thereby significantly reducing the total system cost.
Seoul, March 20 (Bloomberg) -- Samsung Electronics Co., the world's biggest memory chip manufacturer, will invest $600 million to build a new production line mainly for 128-megabit dynamic random access memory chips and rambus Drams, the Yonhap News Agency said, citing the South Korea company. Samsung will begin mass production of
those micro chips, which are used in personal computers, electronics and communications equipment, in the second half of this year in order to preempt the world market.
March 15, 1999, Issue: 1506
Section: products & technology White Box Brain Candy For Your PC
Memory -- System memory product leaders herald Rambus' RIMM, the
'new standard for 1999'
David Myron
Slowly appearing on the memory module horizon is a next-generation, high-performance
plug-in for PC main memory called the Direct Rambus RIMM Module. Rambus Inc. may be accurate when it says that its RIMM module is "the new memory standard shipping for1999," because memory interface technology is expected to make its debut in the PC main
memory marketplace with Intel Corp.'s Camino motherboard. Intel is not alone in its support. Last month, Hewlett-Packard Co.,
Kingston Technology Co. and National Semiconductor Corp. joined a list of more than 50 leaders in system memory implementation products by announcing plans supporting the new technology.
by David Essex, special to PC World
January 18, 1999, 4:00 a.m. PT
High-performance RAM technologies are set to debut this year in high-end PCs and workstations, while per-megabyte prices will likely hold steady at their current low levels, according to chip experts and PC makers. The big news will be the debut of Rambus DRAM, which runs at 600 MHz and higher, more than four times faster than the top limit of the already impressive Synchronous DRAM that became dominant last year. That means much better software performance and improved speeds when running faster peripherals such as DVD drives and hard disks. RDRAM also transfers data more efficiently and can be upgraded one chip at a time, providing more capacity options than
SDRAM
March 1, 1999 (TOKYO) -- Global production of Direct Rambus dynamic random access memory (D-RDRAM) chips will account for about 8.8 percent of all DRAMs in 1999, according to a survey conducted by Nikkei Market Access, an IT data provider. D-RDRAMs are a type of next-generation, high-speed DRAM microchip.
January 20, 1999 (Hong Kong) -- Samsung Electronics Co., Ltd. of Korea began mass producing Rambus DRAMs, a new standard memory device that is expected to replace synchronous DRAM microchips. The Rambus DRAM is projected to be used as main memory in 30 percent of new PCs sold in 1999.
This year, Rambus DRAM chips and synchronous DRAM chips will both be used as main memory solutions. However, as of 2000, the Rambus DRAM is expected to become the principal device for PC main memories.
just one comment on last years news. intel corp announced in nov a $500 million investment in micron for rambus rdram production. that is scheduled to come on line 3d quarter. i have read that micron's rdram production will exceed samsung's.
unclewest |
