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To: tech101 who wrote (131)	3/22/1999 4:52:00 PM
From: tech101	Read Replies (1) \| Respond to of 1056

TI steps up IEEE-1394 push, aims to ship 24 million chips in 2000 A service of Semiconductor Business News, CMP Media Inc. Story posted 9 a.m. EST/6 a.m. PST, 3/22/99 DALLAS--Texas Instruments Inc. here today stepped up its efforts to expand market share in the 1394 serial input/output links with the introduction of a second-generation open host controller interface that integrates more FIFO memory on chip. The increased FIFO depth and a new dynamic allocation feature in TI's TSB12LV23 will boost the performance of IEEE-1394 links in multimedia applications, such as PCs connected to video and audio systems, said Larry Blackledge, worldwide business manager for bus solutions at TI. "This feature increases the ability to manage the bus and reduce errors that result in data packets having to be retransmitted," he said. "This feature also reduces the need for complex error-correction algorithms." The new 100-pin link-layer device works with a two-port physical layer (PHY) chip to support 400-megabit-per-second I/O. TI says it now has shipped about 8 million first- and second-generation 1394 open host controller interface link layer devices since 1995. "We are targeting 24 million in 2000," said Blackledge. Presently, TI estimates that it has produced more than 70% of the physical layer (PHY) devices used in1394-enabled consumer electronics systems. Blackledge said 75% of the camcorders today use TI's 1395 chips. According to a forecast by Dataquest, about 7 million personal computers will be shipped with 1394 serial interfaces this year.