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To: David Lawrence who wrote (6122)	4/23/1999 2:16:00 AM
From: Scrapps	Respond to of 9236

No he didn't elaborate on that David, there was mention of the ADI/AWRE product being used by the likes of Cisco, LU, Siemens and NorTel in switch products. I believe Nortel is using it in their Universal Edge 9000 product and that product maybe included in the Bell Atlantic deal. It'd be nice if others would listen to the replay and comment on thread about it so we can share our perspectives on the recording...AND what isn't included.

To: David Lawrence who wrote (6122)	4/23/1999 3:39:00 PM
From: Scrapps	Read Replies (1) \| Respond to of 9236

Broadband Chipset enables highly integrated DSL-Lite line card Siemens Semiconductors, Infineon Technologies AG as of April 1, 1999, a leader in semiconductors for communication equipment, demonstrates its splitterless voice / DSL-Lite central office chip set B-MuSLIC at CeBitÕ99. The chip set, using DSL-Lite tech- nology from Aware (NASDAQ: AWRE) is the heart of a broadband DSL-Lite line card pre- sented by Siemens Information and Communication Networks (ICN), one of the world- wide leading manufacturers of Central Office equipment. This unique solution combines voice and broadband services in a highly integrated chip set and eliminates the discrete POTS splitter by using broadband SLIC technology. It tightly integrates DSL-Lite data technology into the analog line card architecture re- sulting in a very telephone company-friendly approach, enabling carriers to rapidly de- ploy DSL-Lite services through easy line card upgrades in existing switch and digital loop carrier equipment. In the demonstrated prototype Siemens Semiconductors has implemented all essential DSL-Lite features Ð DMT based asynchronous data transmission, fast retrain, always-on data connections. It proves the concept of a cost efficient integration of standard teleph- ony and broad band data access. While the final, fully standard compliant chip set will incorporate a low power Siemens DSP with a 4-channel DSL-Lite data pump the prototype uses an off-the-shelf DSP together with the Siemens analog parts. SIEMENS Semiconductors Production ramp up for the B-MuSLIC chip set is planned for Q4/99, supporting a high volume roll out of DSL-Lite by year-end. SiemensÕ Semiconductor Group is a leading worldwide provider of integrated circuits, memory products, RF components and discrete and power semiconductors, sensors and fiber optic components. The comprehensive product line of Siemens Semiconduc- tors serves a wide range of customers active in telecommunications, automotive and consumer electronics, data processing and automation. Siemens is the market leader for chip card ICs. In fiscal 1997/98, Siemens Semiconductors achieved sales of $3.8 billion (DM 6.7 billion) and employed 25,000 people worldwide. The group plans to go public. Further information can be found on the Internet at siemens.de The Siemens Information and Communication Networks Group was established on October 1, 1998 as part of the restructuring of the Siemens information and communica- tion activities. Information and Communication Networks has around 60,000 employees and sales of about DM 25 billion, making it one of the world's leading suppliers of end- to-end solutions for voice, data and mobile networks. Information and Communication Networks provides products, systems, solutions, servicing and support for setting up, operating and maintaining complete corporate and carrier networks. It also offers ancil- lary services ranging from network planning and financial consultancy through startup support to user training. Further information on this Siemens Group can be found on the Internet at siemens.com B-MuSLIC Broadband Multi Channel Subscriber Line Interface Concept DSL Digital Subs criber Line POTS Plain Ordinary Telephone Service DSP Digital Signal Processor

To: David Lawrence who wrote (6122)	4/26/1999 10:31:00 AM
From: Scrapps	Respond to of 9236

Infineon Technologies Introduces First Silicon of the CARMEL DSP Core Core for Next Generation Infineon High Speed Modems and Wireless Applications, Licensable to Third Parties SANTA CLARA, Calif.--(BUSINESS WIRE)--April 26, 1999--Infineon Technologies today demonstrated the first functioning silicon of the CARMEL(TM) DSP core. The Carmel development chip (CDEV) integrates the CARMEL DSP core, peripherals and on-chip memory. Infineon exhibited the CARMEL development chip connected to a sophisticated software development system, based on Tasking, Inc.'s EDE(tm) (Embedded Development Environment) tool chain, exchanging debug data between a development host computer and the CARMEL core via an on-chip JTAG port. Dr. Sonke Mehrgardt, executive vice president and chief technology officer of Infineon Technologies, stated: ''I am very proud that we can demonstrate today the first system-on-a-chip based on the CARMEL DSP core. The core, which is a cornerstone of our Logic Initiative, will allow our customers to leverage outstanding DSP performance in products addressing high-growth Internet, multimedia and mixed analog-digital signal applications.'' Will Strauss, president of the Forward Concepts market research firm, comments: ''With the trend toward system level integration, the demand for DSP cores is increasing by a 35% compound annual rate. CARMEL's first silicon confirms once again Infineon's competence in signal processing and core IP development. CARMEL's innovative Configurable Long Instruction Word (CLIW(tm)) architecture allows high performance while maintaining good code density. This presents a significant opportunity for DSP system designers to use CARMEL in function and application specific IC (FASIC) designs, which already represent 56% of the overall DSP chip market. CARMEL Development Chip Features More than a mere laboratory exercise, the development chip features the CARMEL core, 64k x 16bit dual ported data SRAM, 64k x 48bit program SRAM, 1k x 96bit CLIW memory. The CLIW architecture enables up to 15 parallel operations per cycle. The CDEV also implements 8 DMA channels, 8 external interrupts and an externally accessible Flexible Peripheral Interconnect (FPI) bus for peripherals. The chip is packaged in a 447-pin Ceramic Pin Grid Array (CPGA). The first application for the CARMEL DSP technology is Infineon's forthcoming full rate ADSL chipset, with the production version of the Infineon ADSL-D solution designed to integrate two Carmel cores on the same die. Infineon also plans to integrate the CARMEL core in the company's third-generation cellular phone UMTS (Universal Mobile Telecommunication System) platform. The company will announce full details of these CARMEL-based products later this year. CARMEL Development Chip Availability and Licensing Program Infineon will offer a development kit (including samples of the CDEV chip and evaluation boards) to customers and licensees at the end of Q3 1999. The CARMEL DSP architecture represents joint research and development work performed by Infineon and I.C.Com, a Infineon/Nisko joint venture based in Israel. Tony Webster, vice president of Infineon's Microcontroller and DSP Division, said: ''The first CARMEL silicon shows excellent stability and we were able to ramp up a working system in less than one week. The CARMEL DSP core worked as expected, thanks to the competence and the dedication of the technical teams at I.C.Com (Azor, Israel), and in Infineon's Munich DSP center who have been working together to bring CARMEL technology to market.'' To build a broad base of support throughout high growth segments of the embedded IC market, Infineon has established a CARMEL licensing program. Through this program, OEMs can use CARMEL as an off-the-shelf chip during development and low-rate initial production, and then migrate to more cost-effective CARMEL core-based ASICs for volume production. The CARMEL licensing initiative includes a Partner Support Program open to licensees and system integrators. The CARMEL licensing program parallels similar efforts for Infineon's C500 8-bit microcontroller, C166 16-bit microcontroller and TriCore unified instruction set 32-bit microprocessor-microcontroller-DSP core. For information on CARMEL architecture, algorithms and tools, readers should contact Ralph Sucher, ralph.sucher@infineon.com. For information on CARMEL licensing programs, readers should contact Uwe Binnenbruck, uwe.binnenbruck@infineon.com. For general information, visit the CARMEL web site, www.carmeldsp.com. About Infineon Infineon Technologies, formerly Siemens' Semiconductor Group, based in Munich, Germany, is the 10th largest semiconductor manufacturer worldwide according to Cahners In-Stat Group. Infineon provides semiconductor solutions for the telecommunications, automotive, data networking, consumer electronics, and industrial automation markets. The company's comprehensive product portfolio includes integrated system ICs, memory and high frequency components, smart card ICs, discrete semiconductors and power ICs, sensors and fiber optic components. In fiscal 1997/98, the company achieved sales of $3.8 billion (DM 6.7 billion) and employed 25,000 people worldwide. Infineon Technologies Corporation is the company's North American affiliate, with headquarters at 1730 North First Street, San Jose, CA 95112. For general information, contact 800/777-4363; 408/501-6000; or see infineon.com. Note to Editors: CARMEL, CLIW, Infineon, the Infineon logo C166 and TriCore are trademarks of Infineon Technologies AG. EDE is a trademark of Tasking, Inc. All other trademarks are the property of their respective owners. Any statements in this document that are not historical facts are forward-looking statements that involve risks and uncertainties; actual results may differ from the forward-looking statements. Infineon Technologies AG undertakes no obligation to publicly release the results of any revisions to these forward-looking statements that may be made to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events. -------------------------------------------------------------------------------- Contact: Infineon Technologies Martin Chorich, 408/501-6390 martin.chorich@infineon.com biz.yahoo.com