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To: Proud_Infidel who wrote (30489)	5/21/1999 2:16:00 PM
From: Duker	Read Replies (1) \| Respond to of 70976

TSMC, Vanguard form 300-mm fab venture in Taiwan [A second source to the Reuters article. Shouldn't people be getting worked-up about this ??? I would think that it is a big, big deal. --Duker] A service of Semiconductor Business News, CMP Media Inc. Story posted 1:45 p.m. EST/10:45 a.m., PST, 5/21/99 By Sandy Chen HSINCHU, Taiwan -- Silicon foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Taiwanese DRAM maker Vanguard International Semiconductor Corp. have formed a joint venture to build the island's first 300-mm wafer fab, which is expected to cost $2 billion. The two companies here expects to begin construction of the 300-mm plant in Hsinchu next spring with volume production slated for 2002, according to Y.C. Huang, a vice president at TSMC. The 300-mm fab will be equipped to process 0.13-micron ICs, he said. The move to set up a joint venture for 300-mm wafer processing comes as other major semiconductor houses begin to adjust their plans for chip-making on larger-diameter substrates. Most industry analysts believe Intel Corp. will be the first to begin investments in a 300-mm volume fab, located in Hillsboro, Ore. A year ago, the microprocessor giant decided to put the 300-mm plant on hold while it waited for production-worthy tools to become available and an improvement in chip demand. Infineon Technologies AG (formerly Siemens Semiconductors) and Motorola Inc. are already processing 300-mm wafer in a pilot/development facility located in Dresden, Germany. Several other chip companies are also expected to be in the first wave of manufacturers using 300-mm wafers in the next couple of years, including Texas Instruments Inc. in Dallas and Samsung Electronics Co. Ltd. in Korea. Taiwan's TSMC has also promised to be among the early 300-mm fab operators. TSMC, which owns a 26% stake in Vanguard, said each company will have access to 50% of the joint-venture's 300-mm output. The fab will be build on a site originally planned for Vanguard's second 8-inch (200-mm) wafer fab in Hsinchu. Vanguard is operating an 8-inch wafer fab in Hsinchu.

To: Proud_Infidel who wrote (30489)	5/21/1999 4:37:00 PM
From: Ian@SI	Read Replies (3) \| Respond to of 70976

Brian, While I wouldn't have predicted it in advance, it does seem to make sense for the largest foundry in the world to lead the charge to 300mm. Given that TSMC will probably have bleeding edge technology as well as the ability to serve any sector, logic, DRAM, ASICs, ..., I would expect this move to put the pressure on others to get to that same level of efficiency (potentially). The significance of this move, IMO, is to eliminate the risk of another downleg after the move to 0.18µ. Long before 0.18µ is in production, technology buys for 0.13µ and 300mm will sustain the rally. Once 300mm capacity buys start, I believe the expression is, "GET THE SUITCASES, NORTON!!! WE'RE RRRRRIIICCCCCHHHHHHHH." <vbg> JMHO, Ian.