Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: Elmer who wrote (59453)	5/24/1999 10:55:00 AM
From: Scumbria	Read Replies (1) \| Respond to of 1573921

Elmer, Yet all we hear about is pre-release versions! Why is that? My (not so) rhetorical answer. Suppose that there was a limited quantity of parts, and they were all sold, and AMD had no reason to show their cards prematurely. Scumbria

To: Elmer who wrote (59453)	5/24/1999 2:02:00 PM
From: Yousef	Read Replies (1) \| Respond to of 1573921

Elmer & Other AMD Investors ... Here's an interesting article on Motorolo's efforts to integrate Copper damascene and Low K dielectrics --> eetimes.com "Electrical parametric measurements indicated that the structures not only survived the fabrication process intact, but also showed none of the technical problems that have previously plagued porous films, Weitzman said. Line resistance and inter-layer leakage resistance measurements indicated that the metal lines had been properly planarized and that the film remained mechanically sound. While highly successful, the work is the first step in a long qualification process. Weitzman estimated that if future development goes well, the new material could appear in Motorola production processes as early as 2002." Sounds a long way off to me ... I think that Yousef warned about Low K/Cu integration issues. "IBM, for instance, is planning to introduce a sequence of low-k materials, each one appropriate to the process generation in which we will roll it out," Davari explained. "First we made the move to copper metal with a conventional oxide. Next, we plan to move to a fluoridated silicon glass formulation. That will reduce our k by 5 to 10 percent. Then we will move on to new materials. There is one in particular that is looking very good to us right now, that would give us an intrinsic k of about 2.7. From there, we plan to introduce porosity into the material, which will reduce k even further. And from there, we will move into the more exotic materials such as polymers." Sounds like IBM is taking a "surer" approach to Cu/Low K ... I wonder why Motorolo is taking the "risky" path. Could it be that Motorolo is behind ?? Make It So, Yousef