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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Jerome who wrote (30695)	5/28/1999 9:09:00 AM
From: Tito L. Nisperos Jr.	Respond to of 70976

Jerome, You are Right!... For more than 30 years, AMAT (the company and more so the stock) Grew despite the occasional Falling prices of CHIPs... Here's another news that will enhance the future for the stock, despite repeating falling prices of Chips: --- SANTA CLARA, CALIF. (May 27) BUSINESS WIRE -May 27, 1999-- Electrochemical Plating (ECP) and Barrier & Seed Systems Are Key to Accelerating Fujitsu's Transition to Copper (Cu) Devices Applied Materials, Inc. announced today that Fujitsu, Ltd., a leading manufacturer of semiconductor devices, has ordered an Electra(TM) Cu ECP (ElectroChemical Plating) system to form the copper interconnect circuits in its most advanced microprocessors. The ECP system shipped to Fujitsu in the second calendar quarter of 1999, and will be integrated with Applied Materials' Electra Cu Barrier & Seed system which has been in use at Fujitsu for more than a year. tscn.com