mile,
press releases? how many press releases do you want?
rambus has given you what you want. you have to go to the site to read it. rambus is very careful about posting info that comes from the partners not from outside reporters with an agenda.
want more? stick around. they are coming.
don...read this and then announce your short.
unclewest
Press Releases for the 2nd Quarter, 1999
May 1999
May 12, 1999AMP® Releases New Connector for Rambus® RIMM™ Modules
HARRISBURG, Pa. - May 12, 1999 - AMP, a Tyco International Ltd. Company, announces the approval of its new RIMM connector for Rambus RIMM modules. The AMP connector has passed validation testing and meets the required specifications for RIMM modules. The RIMM connector from AMP is currently the only connector to be fully compliant to Rambus specifications for use with the RIMM modules.
May 10, 1999Toshiba to Launch World's Smallest 128- and 144-Megabit Rambus®DRAM in 600MHz, 711MHz and 800MHz speedsToshiba achieves industry's smallest chip size using 0.20 micron process
Irvine, Calif., May 10, 1999 - Toshiba America Electronic Components, Inc.(TAEC) today announced 128- and 144-megabit (Mb) Rambus® dynamicrandom access memory (RDRAM®), bringing the two largest commerically-available Rambus memory capacities to the smallest chips yet realized at thisdensity. Samples of these new memory devices have been shipped to Rambus Inc. for testing and will soon be shipped to customers in module form.
May 10, 1999Denali Introduces Breakthrough Memory Model for Rambus ApplicationsDenali's Turbo Channel model for Rambus subsystem design is shipping now
Palo Alto, CA (May 10, 1999) - EDA company and memory modeling and verification specialist, Denali Software, Inc., announced today that it is shipping its Turbo Channel model, a simulation model for the Rambus® Channel. CompaqComputer Corporation (NYSE: CPQ) is among the first systems houses to use it in the development of next generation Alpha processors.
April 1999
April 26, 1999Rambus Selects Snaketech Solutions for Substrate Modelingand Analysis of High-Speed Devices
San Jose, Calif. - April 26, 1999 - Snaketech, the emerging technology leader in integrated circuit (IC) design tools for RF, analog and mixed-signal designs, and Rambus Inc. (Nasdaq:RMBS), a leading supplier of high-speed interface technology for semiconductor memory devices, today announced the integration of Snaketech's substrate noise modeling and analysis solutions into the Rambus® circuit design flow.
April 23, 1999Samsung First With Intel Validation for Rambus® DRAM - Samsung is the first RDRAM® manufacturer to receive Intel Validation for its 72M and 144M Rambus DRAMs
- The ramp of RDRAM will start in September
San Jose, Calif., April 23, 1999 - Samsung Semiconductor Inc.'s Rambus DRAM successfully passed Intel's RDRAM Validation Test, making Samsungthe first company in the industry to receive such validation for its mass-produced samples. This test validates that Samsung can produce a RDRAM that is fully compliant with the RDRAM specification from Rambus. Samsung's 72M and 144M RDRAMs have been tested and proven to be compatible with the RDRAM specification.
April 20, 1999NMS Announces Development Plans for RDRAM Component and Module High Volume Testing
Santa Clara, CA - April 20, 1999 - NewMillennia Solutions Inc. (NMS) has announced that it is currently developing low cost testers for Rambus® DRAM (RDRAM®) component and RIMM™ Modules. Working closely with Rambus Inc., NMS plans to develop low cost Rambus DRAM testers and provide high-volume available manufacturing systems and solutions for RIMM Module and RDRAMcomponent testing. Initial NMS testers will be available in late 2Q 1999,with high volume available in Q3 1999. NMS has patent-pending, high-volume test technologies that will allow RDRAM component and RIMM Module timing parameters to be tested effectively.
April 20, 1999Tanisys Ships Rambus RIMM Modules for RevenueSupplier to Offer One of Industry's Broadest Lines of 800 MHz RIMM Module
Austin, TX - Tanisys Technology, Inc. (Nasdaq: TNSU), a leading supplier of build-to-order (BTO) custom products for computer manufacturers,today announced it has begun shipping Rambus® RIMM™ modules for revenue and plans to provide one of the broadest lines of RIMM modules in the industry.
April 16, 1999VLSI Licenses Rambus ASIC Cell Interface Technology
San Jose, Calif., April 16, 1999 - VLSI Technology, Inc. (NASDAQ: VLSI) today announced that it has licensed theDirect Rambus™ ASIC Cell (D-RAC), a high-performancechip-to-chip memory interface technology, from Rambus Inc.(NASDAQ: RMBS). Capable of delivering 1.6 gigabytes per second, the D-RAC has signal pin rates of up to 800 megahertzand is ideally suited for the high-speed memory requirements of today's computer, multimedia and networking applications.
April 14, 1999Rambus Reports Fiscal Second Quarter
April 13, 1999Schlumberger Ships Integrated Test Cell Featuring RDX Series Tester and Delta Castle Handler for High Volume RDRAM Device Production Test
San Jose, Calif., April 13, 1999 -- Schlumberger Automated Test Equipment (ATE) today announced that it has shipped an integrated test cell featuring its RDX™ series test system and a Delta Design Castle Mx32 handler to one of the world's largest memory manufacturers. Delta design is a unit of Cohu Semiconductor Equipment Group.
All content © Copyright 1999 by Rambus Inc.For specific information or technical questions please contact info@rambus.com
For comments pertaining to our web site please contact webmaster@rambus.com
Press Releases for the 1st Quarter, 1999
March 1999
March 29, 1999SMART Modular Technologies Ready for Rambus!
- SMART continues to lead the industry in advanced memory module technology - Investment in production and test equipment readies SMART for full- scale RIMM™ module production
FREMONT, Calif., March 29, 1999 - SMART Modular Technologies, Inc.(NASDAQ: SMOD) announced today that it is prepared to begin full-scale Rambus® RIMM™ module production. In anticipation of the industry-wide demand for this advanced memory technology, SMART has made extensive investments in high-speed placement and test equipment, as well as adding key personnel in the areas of engineering, operations and sales to its worldwide facilities. SMART also expects to make an additional $15 to $20 million capital investment in the next eight months to help ensure its readiness for the expected growth in demand for RIMM modules.
March 29, 1999LSI Logic Launches Direct Rambus ASIC Cell Coreware Test Chip Functional at Full 800 MHz Speed.
Milpitas, California, March 29, 1999 - LSI Logic, The System on a Chip Company®, announced today that it has shipped CoreWare® models for the Direct Rambus™ ASIC Cell (D-RAC) in the LSI Logic G11™ process technology (0.18-micron Leff) to customers. In addition, LSI Logic's D-RAC test chip is functional at the full 800 MHz speed.
March 29, 1999HP Wins Memory Test Order in Excess of $10 Million fromLG Semicon Multiple HP 95000 HSM Systems each will Test 16 RDRAM Devices Simultaneously
Palo Alto, Calif., March 29, 1999 -- Hewlett-Packard Company today announced that Korea-based LG Semicon has placed an order in excess of $10 million for several HP 95000 High Speed Memory (HSM)Series test systems.
March 24, 1999Schlumberger K.K. to Open Regional Technology Center in Japan
Tokyo, Japan, March 24, 1999 -- Schlumberger K.K. today announcedthat it is opening the Rambus® Satellite Characterization Center (RSCC)at its headquarters in Fuchinobe, Japan in May 1999. The state-of-the-arttechnology center will be operated by Schlumberger Advanced Business Engineering Resources (SABERSM), a Schlumberger business unit that provides innovative technical and business management services to the semiconductor industry.
March 24, 1999Schlumberger to Open SABERSM Technology Centers in Key Technology Markets Across the Globe
San Jose, March 24, 1999 -- Schlumberger today announced that itplans this year to open eight Schlumberger Advanced BusinessEngineering Resources (SABERSM) worldwide technology centersto meet the highly targeted needs of regional customers. The first SABER technology center -- the Rambus® Satellite CharacterizationCenter, which opened today in Fuchinobe, Japan -- focuses on Rambustechnology. Seven additional sites are being opened in Silicon Valley,Taiwan, Singapore, Korea, France and the U.K. during the coming year.
March 9, 1999
Schlumberger SABERSM Group Offers Semiconductor Industry'sonly RDRAM® Consulting ServicesNew RDRAM Services Help Memory Manufacturers Achieve Fastest Possible Time-to-Volume and Profitability
San Jose, March 9, 1999 -- Schlumberger Advanced Business Engineering Resources (SABERSM), a business unit that provides comprehensive operational and business management services to helporganizations optimize profits, today announced that it has begunoffering serices for RDRAM® technology. Designed to assist memorymanufacturers to successfully ramp production of RDRAM devicesand achieve the fastest possible time-to-volume while increasing profitability, SABER services for RDRAM technology include design validation, device characterization and production.
March 9, 1999Schlumberger Announces Availability of Fully Compatible, High-Performance RDRAM® Test SystemsRDX2200™ Series is Proven to Meet or Exceed RDRAM Accuracy Specs, Slash Months off the Development Cycle and Increase Yields
San Jose, March 9, 1999 -- Schlumberger Automated Test Equipment today announced a fully compatible series of high performance RDRAM® test systems designed to significantly shrink memory manufacturers' time-to-volume and dramatically increase yields.
March 9, 1999Schlumberger Provides Industry's Only Total Test Solution forNew RDRAM® DevicesComplex RDRAM Test Challenge Extends Well Beyond Hardware
San Jose, Calif., March 9, 1999 -- Leveraging unmatched industry knowledge,technology leadership, management services and global resources, SchlumbergerAutomated Test Equipment (ATE) has demonstrated that it is the only companycapable of providing a total test solution for memory manufacturers' unprecedentedramp to high-volume production of RDRAM® devices.
March 8, 1999PNY to Manufacture Direct Rambus™ Memory ModulesPNY Licensed by Rambus to Manufacture, Sell, and Distribute RIMM™Memory Modules
Parsippany, New Jersey (March 08, 1999) -- PNY Technologies, Inc., a global leader in the design, manufacture and distribution of memory and CPU upgradeproducts, announced today the signing of a partnership agreeement with Rambus Inc. to design, manufacture, and sell Direct Rambus™ memory modules,or RIMM's. The agreement grants to PNY the rights for RIMM manufacture at each of its worldwide facilities at Parsippany, New Jersey; Santa Clara, California;and Bordeaux, France. Initial design and manufacture will be done at the Santa Clara facility with a phase in at the other locations as the market for the new technology expands. Although initially targeted for contract of state-of-the-artupgrade memory to include the industry's latest memory technology for offeringhigh-bandwidth memory solutions.
March 1, 1999
Amkor Technology to Double Capacity of µBGA® Chip-scale Packages
March 1, 1999, West Chester, PA. -- Amkor Technology, Inc. (Nasdaq:AMKR)
the world's leading provider of packaging and test services for the semiconductor
industry, today announced plans to double production capacity of its µBGA chip-scale
(CSP) packages by mid-1999. Amkor delivered more than 14 million µBGA packages
since the state-of-the-art package was introduced last year. Under current plans, the
production capacity will be increased to 6.0 million units per month.
February 1999
February 24, 1999
Rambus Reveals Specification for Mobile System Memory Components
Twice the bandwidth and less power than today's mobile memory systems
Palm Springs, Calif. - February 24, 1999 - Rambus Inc. today announced at the Intel
Developer Forum the specifications for Rambus® memory devices, SO-RIMM™
modules and connectors for mobile computers. Intel and Rambus have worked together
on these specifications to ensure that laptops utilizing Rambus Technology deliver
over two times the memory bandwidth of today's SDRAM solutions, while meeting
the power consumption and physical space requirement demanded by mobile form
factors.
February 24, 1999
Toshiba and Kingston Deliver First Toshiba Rambus SO-RIMM Modules
Low-power SO-RIMM Modules to be displayed at Intel Developers' Forum
Irvine, Calif., Feb. 24, 1999 - Toshiba AmericaElectronic Components, Inc. (TAEC)
and Kingston Technology Company today announced delivery of Toshiba's first
Rambus® small form factor SO-RIMM™ module prototypes for mobile systems to
Rambus Inc. The prototype 64 megabyte (MB) RDRAM® SO-RIMM modules will be
on display today in Rambus' exhibit at the Intel Developers' Forum in Palm Springs.
February 24, 1999
SMART Modular Technologies, Inc. Announces the Development of SO-RIMM™
Modules
- 160-Pin Rambus SO-RIMM™ Modules
- Target applications with space limitations
- SMART invests to help ensure system and component compatibility
FREMONT, Calif., Fenruary 24, 1999 - SMART Modular Technologies, Inc.
(NASDAQ:SMOD) announces today that it has begun sampling 160-pin Rambus®
SO-RIMM™ memory modules. The SO-RIMM modules are manufactured with
RDRAM® devices and run at a speed of 1.6 GB per second of peak bandwidth,
the memory industry's highest speed. The SO-RIMM modules are targeted for use
in space-constrained electronic systems such as notebook computers, games, printers
and networking and telecommunications equipment.
February 24, 1999
Molex Partners with Rambus on SO-RIMM™ Socket Technology
Lisle, Illinois -- February 24, 1999 -- Molex Incorporated (NASDAQ:MOLX,MOLXA)
a global connector manufacturer, today announced its partnership with Rambus Inc.
on the development of a memory socket for SO-RIMM™ (Small Outline RIMM Modules)
memory modules. The Rambus® SO-RIMM module technology will enable the DRAM
industry's highest level of performance for low-profile, small form factor memory
applications, including notebook computers. Molex intends to have samples of the
SO-RIMM socket available by the end of the first quarter and to fully support volumes
as the market dictates.
February 23, 1999
RVSI Vanguard Announces Processing Capabilities for RDRAM® Based Micro BGA®
Devices
Nepcon West -- February 23, 1999 -- RVSI Vanguard today announced the company's
newest capability to perform ball attach processing for the next generation of chip scale
packaging technologies, including RDRAM based Micro BGA devices.
February 22, 1999
Hyundai Electronics Announces Availibility of 64 Mbit Rambus® DRAM
Hyundai will marshal its DRAM manufacturing forces to meet worldwide
Rambus® demand
San Jose, CA, February 22, 1999 -- Hyundai Electronics today announced
availibility of its new 64 Mbit Rambus DRAM and its new 64 Mbit ECC (also known
as 72 Mbit) Rambus DRAM (RDRAM®) product family. Designated the HYRD64E840/
HYRD72E840 Series, the new 0.22 micron-based RDRAM will be available in production
quantities in mid 2Q '99. Later this year, Hyundai will introduce its 128 Mbit and its
144 Mbit ECC version on a separate die to give PC OEMs an additional cost-effective
choice.
February 22, 1999
Kingston Announces Rambus RIMM Development Modules for Intel 1999 PC Platforms
Kingston RIMM Module Samples Immediately Available
Fountain Valley, CA -- (February 22, 1999), Kingston® Technology Company today
announced support for Intel® Corporation's 1999 PC platforms utilizing Rambus®
memory technology. These new platforms will enable the use of Rambus memory
modules, (RIMM™ Modules), which achieve a peak bandwidth of up to 1.6 GB per
second using 800 MHz RIMM modules. Kingston is introducing the first memory
module industry's RIMM Module sample program to support PC, motherboard and
system manufacturers in developing their Rambus-enabled products. Information is
available online at www.kingston.com/rambus.
February 18, 1999
Tanisys Announces First Affordable Rambus Module Tester
Austin, TX ... Tanisys Technology, Inc. (NASDAQ:TNSU), a leading supplier of
memory test equipment under its DarkHorse® Systems brand, announced today
the industry's first affordable tester for 800MHz Rambus® RIMM™ memory modules.
February 10, 1999
National Semiconductor Licenses Rambus Interface Technology
High Bandwidth Supports Future High-Performance Processors
Santa Clara, Calif. - -February 10, 1999 -- National Semiconductor Corporation
(NYSE:NSM) announced today it has licensed the Rambus high-bandwidth 800 MHz
memory interface for the use in future integrated processors developed by its Cyrix
subsidiary. Rambus memory technology provides the highest level of DRAM
performance currently available -- 1.6 gigabytes per second of peak bandwidth from
a single device.
February 9, 1999TI Announces High Volume Burn-in Test Solution For Direct Rambus Memory
Interface Technology
Attleboro, Mass. -- February 9, 1999 -- Texas Instruments' Interconnection Business
today announced the availability of a family of burn-in test sockets for Direct Rambus
memory devices. The new sockets will enable DRAM manufacturers to test devices
that incorporate the popular memory management architecture developed by Rambus Inc.,
ensuring they are fully tested and burned-in.
February 8, 1999
SwitchCore Uses 800MHz Rambus Interface to Provide Highest Performance
Network Switch
San Jose, Calif., February 8, 1999 -- SwitchCore announced today that they are
using the 800MHz Rambus® interface in their next-generation network switch
products. The Rambus interface supports 800 Mbits/second/pin and will allow
SwitchCore's next-generation products to offer the only single chip 16-port Gigabit
Ethernet layer 3 switch, raising the bar in switching and routing throughput for the
networking industry.
February 2, 1999
Teradyne Introduces ARIES/Castle Integrated Test Cell for Direct
Rambus Production
Agoura Hills, Calif., February 2, 1999 -- Teradyne, Inc. (NYSE: TER - news)
announced it has received multiple orders for the ARIES/Castle Integrated Test
Cell for use in the production testing of Direct Rambus DRAM. Scheduled to
begin shipping in the second quarter of 1999, the high throughput test cell combines
the high parallelism and fault coverage of Teradyne's ARIES memory test system
with the fast index time and small footprint of Delta Design's Castle memory test
handler.
February 2, 1999
HP Licenses Rambus Interface
Palo Alto, Calif., February 2, 1999 -- Hewlett-Packard Company and Rambus Inc.
announces that HP has licensed Rambus interface technology and intends to offer
Rambus memory subsystems to a variety of HP system divisions.
February 1, 1999
Kingston Technology Invests $16 Million for Advanced Testing Systems
New Testing Equipment Readies Kingston for Next Generation Memory
Technologies
Fountain Valley, Calif. -- (February 1, 1999) Kingston Technology Company
today announced that it has invested more than $16 million in the most
advanced testing equipment available for next generation memory technologies
such as SDRAM, DDR and Rambus RIMM™ Memory Modules.
January 1999
January 27, 1999
Toshiba Continues String of Rambus Leadership Firsts
Toshiba Rev. B RDRAM Samples Enable Intel Testing of Fully Loaded System
Irvine, Calif., January 27, 1999 - Toshiba America Electronic Components, Inc.
(TAEC) today announced another Rambus® technology leadership achievement
with the delivery of its 64 megabyte (MB) and 128MB Revision B Rambus
RIMM™ memory module samples to Intel. This makes Toshiba one of the first
suppliers to submit samples that allow Intel to test a fully loaded 800 megahertz
(MHz) system with 32 RDRAM® devices.
January 25, 1999
TSMC Announces Support for High-Bandwidth Rambus® Memory in its
0.25-µm Process TechnologySilicon-Verified RAC Accelerates Design Cycle
San Jose, Calif., January 25, 1999 -- Taiwan Semiconductor Manufacturing
Company (TSMC) (NYSE: TSM) today announced an agreement to support
the Rambus® ASIC Cell (RAC) to its 0.25 -µm logic process. The RAC offers
superior performance and a high-bandwidth standard interface for high-volume,
low cost memory controllers to the Rambus 800 MHz memory. End product
applications include main memory chip sets, graphics controllers, multimedia
controllers, peripheral controllers and network switch controllers.
January 19, 1999
Apacer Ready for Mass Production of its RIMM™ Module
Rambus® Partner Announces the Availability of its RIMM Product
San Jose, CA -- Apacer Memory America Inc., the quality provider of
high-performance memory modules, is in the leading position to provide its
strategic motherboard and OEM partners with its RIMM module for
compatibility testing with Intel's next generation chipset. Apacer engineers, who
have been working with Rambus since mid-1998 to develop the RIMM Module,
have announced that it is in gear for mass production of the memory industry's
hottest new technology.
January 19, 1999Winbond to Provide 1.6GB/sec Rambus Memory Devices
Leading Taiwan DRAM Company to sample initial devices in Q3
(Hsinchu, Taiwan and Mountain View, Calif. -- January 19, 1999) -- Winbond
Electronics Corporation and Rambus Inc. today announced that Winbond has taken a license for the Direct Rambus™ high-bandwidth memory-interface
technology. Winbond will incorporate the interface into forthcoming
144M/128M and beyond dynamic random access memories (DRAMs), with
initial devices expected to sample in the third quarter of 1999 and volume
production planned for the fourth quarter, year 1999.
January 18, 1999
Samsung Electronics Taking Command of Next-Generation High-Speed DRAM Market
**Mass Production of Rambus® DRAM Starts Up**
-Samsung is leading the market for the chips that will replace synchronous
DRAM
-Initial Rambus® DRAM production is set at 500,000 chips a month.
-Samsung has started receiving volume orders from leading PC OEMs.
Seoul Korea - January 18, 1999 - Samsung Electronics Co., Ltd., has started
mass production of Rambus® DRAMs, the next-generation standard memory
device. The company has gained a leading position in the market for memory
chips that will replace synchronous DRAM.
January 18, 1999
UMC Foundry Services Available to Rambus Chip Customers
Sunnyvale, Calif. -- January 18, 1999 -- UMC Group announced today
that it is the first semiconductor foundry to expand its services to controller
chip product developers that utilize Rambus' memory interface -- the
Direct Rambus ASIC Cell (RAC). Rambus Inc. (NASDAQ: RMBS) today
also announced it has successfully fabricated the RAC in the form of test chips
on UMC's 0.25 micron process (Gold Logic™ L250).
January 14, 1999Rambus Reports Fiscal First Quarter
January 12, 1999Acer Laboratories, Inc. Supports Rambus Memory to Advance Consumer PCs
Acer Laboratories to provide PC Chipsets using Rambus 800MHz Memory
January 12, 1999 - Taipei, Taiwan - Acer Laboratories, Inc. of Taipei, Taiwan
("ALi") announced today that they have licensed Rambus 800MHz memory
interface technology and will provide PC chipset products supporting Rambus
DRAMs during 1999. The Rambus-based chipsets will allow the performance
of high-end PC desktops to be available in affordable consumer PCs.
January 11, 1999
TwinMOS to Provide Rambus 800MHz Memory Modules
Taipei, Taiwan, January 11, 1999 - TwinMOS Technologies, Inc.
announced plans today to provide Rambus® 800MHz RIMM™ memory
modules. TwinMOS expects to enable use of Rambus memory in the PC
market to meet Taiwan system manufacturers' needs to enhance global
competitive advantage for OEM/ODM customers or retailers' requirement.
Intel, with the endorsement of leading PC OEMs, is enabling Rambus
memory for use in performance desktop PCs in 1999.
All content © Copyright 1999 by Rambus Inc.For specific information or technical questions please contact info@rambus.com
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