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To: FLSTF97 who wrote (2890)6/4/1999 8:04:00 AM
From: Duker  Read Replies (1) | Respond to of 5867
 
FLSTF97,

It is my understanding that AMAT and TEL have been the prime beneficiaries of LRCX's slippage in the oxide etch arena ...

FWIW, I believe Sue Billat posed a similar question on the last conference call and JB responded by saying that (paraphrase)"TEL had good technology in dielectric etch, but was exhibiting some vulnerability in Dual Damascene apps."

In terms of the new system being better or equivalent ... come on ... Exelan, baby ... It Screams High Performance!

How can that not be good?

Seriously, I have not read an unbiased, 3rd party view of the system vis a vis AMAT and TEL's systems ... I would be very interested in hearing about it though ...

--Duker



To: FLSTF97 who wrote (2890)6/4/1999 3:28:00 PM
From: Jong Hyun Yoo  Read Replies (1) | Respond to of 5867
 
LAM has lost market share to primarily to TEL even though AMAT
also snatched a good portion of it. My feeling is that previous
market share loss stems from the underperformance in the hardware
reliability and throughput of the overall system not from the process
performance. LAM has debugged many hardware problems associated
with transition to alliance platform and TCP chamber. Since then
it has also boosted system throughput with the dual robot configuration. The New EXELAN system sounds great even though
I have not heard the feedback from the chipmakers yet. I also like
the timing of the release, just before the market upturn.