To: NightOwl who wrote (7560 ) 8/15/2000 12:31:44 AM From: pat mudge Read Replies (1) | Respond to of 14464 Did you see this? Cypress' Fab 4 in Minnesota to double capacity by late 2001 Semiconductor Business News (08/14/00, 07:57:05 PM EDT) BLOOMINGTON, Minn. -- Cypress Semiconductor Corp.'s Fab 4C expansion in its chip plant here is ramping into volume production with a goal of reaching full capacity by late 2001, the company said today. When the new module is at full capacity, the facility will nearly double its chip-pricessing volumes to 29,000 eight-inch wafer starts per month, said Chris Seams, vice president of wafer fabrication at Cypress. The frontend line is located adjacent to the Fab 4A and Fab4B modules in the same cleanroom space. Fab 4C is initially being brought up into production with a 0.25-micron process technology but it will shift over to Cypress' new 0.15-micron RAM7 technology next year, Seams said. The RAM7 technology has the capability of producing an 8-megabit SRAM on a die measuring 20 square millimeters using Cypress' patented six-transistor cell (see Aug. 7 story). Cypress plans to use the new Fab 4C module to produce communications ICs for wireless terminal and wide-area network (WAN) applications. RAM7 technology has produced functional silicon and will be used for over 10 new products next year, according to the San Jose-based chip maker. Cypress opted to bring up its Bloomington plant in three increments with Fab4C being the last module in the facility. "The incremental increase of capacity enabled by Fab 4C, combined with additional outsourced foundry capacity, will enable Cypress to scale our manufacturing capabilities to meet the growing needs of our customers, while minimizing the risk of overcapacity," said Rich Freeman, vice president of worldwide manufacturing at Cypress.