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To: Joe NYC who wrote (127797)	2/19/2001 12:44:39 AM
From: Ali Chen	Read Replies (1) \| Respond to of 186894

"What's the approximate relation between the processor case temperature and the die temperature?" Joe, The exact data for P4 package are not published AFAIK. As a guess, the P4 die is covered by a copper heat cup (or spreader), about 0.5mm thick. Given the copper conductivity at 4 W/cm/K and assuming about 100W/cm power density, the temperature difference across the cup should be less than 1K. Taking into account some mechanical deviations, I guess the difference between the "die surface" temperature (in AMD definition) and the "case surface" should not exceed 3 degrees C. Regards, - Ali

To: Joe NYC who wrote (127797)	2/19/2001 1:24:37 AM
From: Mani1	Read Replies (1) \| Respond to of 186894

Jozef re <<What's the approximate relation between the processor case temperature and the die temperature?>> The resistance of the thermal lid itself is less than 1 degree, the main temperature rise happens in the interface which is filled with sliver paste. That conductivity can be as much 90,000 W/m^2.k, so with die power density of...errr... 50 W/cm^2, then total temp rise is 6 degrees. If the die size is reduced (power density increasing), then it gets that much more difficult. So bigger the die, the easier it is to cool it. Mani