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To: whortso who wrote (66565)	12/29/2001 1:04:54 AM
From: Elmer	Read Replies (2) \| Respond to of 275872

Elmer, I have heard that Intel doesn't do any testing of the functions of a chip. They do something called testing the structures or structure testing, something like that. How can you test a device without testing how it functions? Oh my! You sure you want me to get into this? This is one of the most highly debated topics there is in semiconductor testing. Functional vrs Structural testing. I teach classes on both and it's far too complicated to waste bandwidth on this thread. Nobody here has even heard these terms. Too bad Scumbria is gone. He'd at least know what the terms meant. The ultra extreme condensed readers digest version would be this, you don't have to add 2+2 and get 4 to prove the device works correctly. If the you can more easily show the gates that do the addition are defect free then you have accomplished the same thing. Maybe you should ask Dan? It would be fun to see what kind of bulls*it he'd make up to explain it. EP

To: whortso who wrote (66565)	12/29/2001 1:22:15 AM
From: semiconeng	Read Replies (2) \| Respond to of 275872

Elmer, I have heard that Intel doesn't do any testing of the functions of a chip. They do something called testing the structures or structure testing, something like that. How can you test a device without testing how it functions? Whort I think that you're referring to the wafer manufacturing process, as i know intel does functional testing of finished die as well as packaged chips. As I understand it, in order to insure the semiconductor manufacturing process is working properly, in-line monitoring is done using various analytical techniques, on test structures, in the scribe line area in between the die, or sometimes rarely, on the die itself. If the test structures are the correct critical dimensions and or functionality, the die structures most likely are too. of course, nothing is absolute......until e-test. Why not do it all directly on die and be absolute? Some analytical equipment is destructive itself. For example, the energy emitted by a Scanning Electron MicroScope can damage the Critical Dimension structures being measured. Also, if there is a malfunction mechanical scratch or damage from the analytical tool, better to aim for between the die. Additional Electrical e-testing of the die functionality is probably done several times during the process also. Semi ps - i know exactly what products i am working with. :-)