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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: eracer who wrote (202234)	6/14/2006 6:26:46 PM
From: BUGGI-WO	Respond to of 275872

@Eracer - DCs " I don't know how exactly how big of an impact it has on production. BUGGI thinks it is substantial. Certainly it is not inconsequential. " When I use the old ICK DIE calc. - I get for DD=0,25 these: - 185mm^2 -> 200mm = 84 Net DIE (300mm = 212) - 230mm^2 -> 200mm = 64 Net DIE (300mm = 148) So the difference on 200mm is around 20 Net Dice or around 30% more and on 300mm around 65 Net Dice more which is around 40-45% more. So assume 1000 WSPW in FAB36 the difference in 1 quarter will be: 1000 x 13 x 65 = 845.000 Net Dice. So, the math isn't that simple, just because you don't switch from 100% 2x1 to 100% 2x512 instantly, but its easy to spot, that AMD could produce up to 1Mio. more, if they use some 300mm space. 1Mio. per 200-300$ isn't that low revenue ... BUGGI

To: eracer who wrote (202234)	6/14/2006 6:41:01 PM
From: combjelly	Read Replies (3) \| Respond to of 275872

"What might be "acceptable yields" for a 120mm^2 CPU may not be acceptable for a 230mm^2 CPU in an increasingly competitive pricing environment." It isn't an issue of yields. In fact, because the increase is purely in a structure that is protected with redundant cells, the percentage of die lost due to defect density will be lower with the larger caches. Now a 230 mm^2 die means about 250 die candidates per wafer. 183 mm^2 dies means about 330 die candidates. So that is the equivalent of increasing production by about 30%.

To: eracer who wrote (202234)	6/15/2006 9:44:27 AM
From: hurricanehicken	Respond to of 275872

One advantage of using the smaller die would be far more efficient scanner use, and that is by far the most expensive piece of equipment in a fab. I don't know exactly what reticle size AMD uses, but they are usually in the 24x24 or so range. Depending on the die layout, you could get 3 512K DC die in one exposure, but with the 1M DC die, you could only get 2. The larger die would limit the WSPW, and I think you would only see mainstream parts using 1M if AMD ran into a lack of demand problem.