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To: Investor A who wrote (21752)12/4/1997 5:31:00 PM
From: Pravin Kamdar  Read Replies (2) | Respond to of 33344
 
Fuchi,

Once again TI comes up with a breakthrough in innovation. Xerogel is a facinating idea. I can't wait to hear more about it. If the bubbles are not connected together (which I doubt), it would also reduce mechanical stress across large wafers; or ever large system-on-a-chip devices. I wonder if TI will license it to others.

Pravin.



To: Investor A who wrote (21752)12/4/1997 8:39:00 PM
From: FJB  Read Replies (1) | Respond to of 33344
 
Foundry capacity glut in SE Asia.
techweb.cmp.com

I know what Fuchi would use the capacity for <g>, but I wonder if National is going to take advantage of it.

Bob


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