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To: Paul Engel who wrote (2819)	12/10/1997 12:17:00 AM
From: Petz	Read Replies (2) \| Respond to of 6843

Paul, re:<C4 bump processing> Please explain what this is. I've noticed that most K6 chips are apparently packaged in the far east. Are these IBM or AMD fabs? Petz

To: Paul Engel who wrote (2819)	12/10/1997 12:25:00 AM
From: Petz	Read Replies (3) \| Respond to of 6843

Paul, re:<Intel's C4 bump processing> You say that Intel does this themselves on their 0.25 micron process. Is this true for both the Tillamook and the upcoming Deschutes? Also, can any AMD insiders reveal if AMD intends to do the C4 bump processing themselves instead of sending to IBM. I say this because I imagine that fingerpointing can get to be as time consuming as the processing itself when two companies have to hand over thousands wafers containing over a hundred parts to eachother weekly. Petz