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Politics : Formerly About Advanced Micro Devices -- Ignore unavailable to you. Want to Upgrade?

To: kash johal who wrote (43452)	12/15/1998 2:58:00 PM
From: Kevin K. Spurway	Respond to of 1572893

Re: "retrofitting existing fabs to use copper interconnect rarely works" Explains Intel's reluctance to go to copper. Would cost way to much retrofitting all those fabs. Kevin

To: kash johal who wrote (43452)	12/15/1998 3:08:00 PM
From: Tenchusatsu	Read Replies (4) \| Respond to of 1572893

<AMD says Dresden fab rivals latest Intel plants> Thanks for the article, Kash, but seeing is believing. Of course, the same is true for Intel's 0.18 micron process, but because AMD was the one who had the rocky transition to 0.25 um, AMD has the burden of proof. <Not only is it calling its latest wafer fab a world-class plant but it claims it rivals any production facility of Intel Corp.> I'll let Paul reply to this statement. Tenchusatsu

To: kash johal who wrote (43452)	12/15/1998 7:33:00 PM
From: Yousef	Read Replies (3) \| Respond to of 1572893

Kash, Re: "VERY VERY IMPORTANT ARTICLE. Bottom Line: 0.18 WITH COPPER in 2H 99 on K7 from DRESDEN ..." Yes Kash, this is a VERY VERY IMPORTANT ARTICLE. Let me tell you some of the very "troubling" things in this article that should set off "warning lights" for AMD investors. I earlier warned Maxwell (and others) about process integration problems that AMD/Motorolo was having with its Copper process. Message 6491020 Message 6606138 Here is the quote from this article that "worries" me the most --> "Dresden also will introduce low-k dielectric materials as processing moves to 0.18-micron feature size. This will increase K-7 speeds by greatly reducing the intra-layer and inter-layer capacitance, he said. AMD hasn't settled on the low-k material it will be use, but barium-strontium-titanate (BST) and paraline compounds are candidates." AMD is claiming to be less than 1 year from "mass production" and they haven't even settled in on their Low K material ?? Let me tell you a process development "double secret"; the material characterization, process integration (for yield), and reliability testing will take close to two years to reach manufacturability. I hope that analysts ask AMD "tough questions" about this issue ... People on this thread should watch this very closely. Make It So, Yousef