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We provide software and services that enable the design and first-time production success of complex integrated circuits, or ICs, for communications, computer and consumer products. Our products enable our customers to deliver timely, competitive systems-on-chip, or SoCs, implemented in deep submicron, or DSM, technologies. Our customers can gain a competitive advantage by using our products in advance of manufacture to verify that the IC design will perform as intended. Customers successfully using our products include leading chip and system vendors such as AMD, ATI Technologies, Cadence Design Systems, Infineon, Silicon Graphics, STMicroelectronics, Sun Microsystems, Texas Instruments, Toshiba and Vitesse Semiconductor. Semiconductor, consumer electronics and other technology product manufacturers depend on their ability to launch products successfully and cost effectively within narrow market windows. First-mover advantage when introducing new products is vital to capture dominant market share for a given product segment, making the efficiency of design and manufacturing processes critical to competitive positioning. Delays caused by unanticipated design flaws can force product launch postponement or cancellation, resulting in the failure of products, divisions and even companies. At the same time, demand for portable, power-efficient and high-performance electronic products, such as cell phones, has driven IC manufacturers to design complex SoCs with small feature sizes reaching 0.18 micron and below. "Feature size" relates to the size of an IC's components and is measured in microns, or millionths of a meter. These SoCs integrate digital components, such as microprocessors and memory, together with analog components, such as radio-frequency receivers and analog-to-digital converters, into a single chip. Designers of SoCs face numerous constraints posed by semiconductor physics at small feature sizes, which challenge traditional design software and can result in expensive design and manufacturing iterations. In addition, designers are sometimes unable to diagnose and address design flaws that cause their chips to fail. As IC geometries have decreased to 0.18 micron and below, the percentage of defective chips has increased dramatically. The Collett International Research, Inc. 2000 survey reports that in 1999, 48% of chips released to manufacture in North America required more than one manufacturing iteration for production ramp-up. Our software and services offer comprehensive, high-speed verification designed to ensure DSM ICs will function as intended, despite the complex effects of semiconductor physics. The benefits we provide to our customers stem from our expertise in chip design, computer science algorithms and software engineering, and include: - Advancing DSM IC design and manufacture: Our full-chip analysis capabilities are a key enabler for electrical correctness throughout the design process. Our products facilitate DSM closure -- the point in the IC design cycle where all DSM-related problems are corrected and power integrity, timing integrity, signal integrity and reliability goals are all met. - Accelerating product time-to-market: Our software and services accelerate time-to-market by helping designers deliver ICs that function as intended, with fewer costly design and manufacturing iterations. - Delivering lower cost per chip: Our products increase design process efficiency, resulting in lower production costs, increased chip reliability and reduced end product maintenance costs. Our customers use our products to successfully design ICs such as microprocessors, application-specific integrated circuits, digital signal processors and high-end graphics processors for many equipment markets including computers, networking, wireless and communications. In addition, we have developed strategic relationships with semiconductor manufacturers and software vendors in our customers' supply chain to integrate our software and services throughout our customers' design-through-production cycle. For example, we work with leading semiconductor manufacturers, or foundries, to measure the accuracy of our products and to obtain access to the most advanced semiconductor processes. These foundries include Chartered Semiconductor Manufacturing, IBM, NEC, STMicroelectronics, Toshiba, Taiwan Semiconductor Manufacturing and United Microelectronics. Many of these foundries now recommend the use of our products to their customers to help ensure high-quality results from manufacturing. We also participate in software integration programs with Cadence Design Systems, Mentor Graphics and Synopsys. Intel holds an 8% pre-IPO stake. CS First Boston is set to be the lead underwriter. | ||||||||||||
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