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Zarlink Sets Industry Benchmark by Launching First Integrated RF Chipset for Cable Set Top Boxes TUESDAY, JANUARY 08, 2002 9:30 AM - PRNewswire OTTAWA, CANADA, Jan 8, 2002 /PRNewswire via COMTEX/ -- Zarlink Semiconductor (ZL) today announced availability of the industry's first integrated chipset for splitting, tuning, and processing digital and analog RF (radio frequency) cable signals. Zarlink's benchmark silicon significantly lowers the cost of designing next-generation, multi-tuner cable STBs (set top boxes) that deliver multiple digital services, by replacing more than 150 discrete front-end RF components with three high-performance, off-the-shelf integrated circuits. Cable television companies are demanding compact, low cost, multi-tuner STBs that support a range of emerging digital applications, such as interactive gaming, home shopping, video-on-demand, and cable telephony. Zarlink helps designers meet these requirements with the industry's most highly integrated chipset for front-end RF tuning. Optimized for delivering multiple applications, the chipset reduces the board space needed for RF tuning by 45 percent, and slashes system costs by up to 30 percent. "These devices set new industry benchmarks for integration, performance, component reduction, and power consumption," said Nick Cowley, RF systems specialist, Zarlink Semiconductor. "The chipset allows customers to shrink the size and cost of multi-application STBs by eliminating dedicated RF boards and integrating RF front-end functions directly onto their motherboards." Three-device set built for performance Zarlink's integrated RF cable chipset is comprised of the SL2150F front- end power splitter, the SL2101 broadband converter tuner, and the SL2009 dual- stage IF (intermediate frequency) amplifier. All three devices comply with CableLabs' DOCSIS (data over cable service interface specifications) 1.1 OpenCable standard, and the US FCC (Federal Communications Commission) Part 15B EMI (electromagnetic interference) requirement. The SL2150F power splitter features a greatly simplified RF architecture. The device combines a very wide dynamic operating range of 50-860 MHz (megahertz) with a four-channel power splitter and four buffered outputs. The SL2150F features a low-noise input preamplifier and independent AGC (automatic gain control) on each output, ensuring a minimum of 25 dB (decibels) of gain control across the input frequency range. The device interfaces with up to three SL2101 tuners and provides a bypass channel for the RF remodulator. The SL2101 is a synthesized, double-conversion, up-down tuner. The device includes a bus-controlled PLL (phase locked loop) synthesizer that delivers very low phase noise performance. The SL2101 draws a maximum current of only 75 mA (milliamps), less than half the power of competing chips. A unique, patent-pending programmable feature allows the chip's power settings and inter- modulation performance to be customized, within a single design implementation, for different types of consumer applications. The SL2009 IF amplifier has two stages of IF gain, both with independent AGC, which combine to deliver 34 dB of gain control. The first stage includes a level detector to control gain in the SL2150F. The SL2009 is optimized to interface to standard SAW (surface acoustic wave) filters. Pricing and Packaging All three Zarlink devices are now in volume production. In 10k quantities, the SL2150F is priced at US$2.25, the SL2101 at US$1.68, and the SL2009 at US$1.25. The SL2150 is implemented on IBM's advanced SiGe (silicon germanium) process and offered in a miniature leadless QFP (quad flat pack). The SL2101, also built on IBM's SiGe process, is offered in a 28-pin SSOP (shrunk small outline package). The SL2009 is fabricated in Zarlink's high- speed bipolar process and packaged in a 16-pin SSOP. Evaluation boards are now available for each chip. The reference design and evaluation board for the integrated chipset will be available in February 2002. About Zarlink Semiconductor Zarlink employs its formidable analog, digital and mixed-signal capabilities to offer the most compelling products for wired, wireless and optical connectivity markets and ultra low-power medical applications. For more information, visit www.zarlink.com. Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the risks discussed in documents filed by the Company with the Securities and Exchange Commission. Investors are encouraged to consider the risks detailed in those filings. Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. SOURCE Zarlink Semiconductor CONTACT: Michael Salter, Media Relations, 613 270-7115, michael.salter@zarlink.com; Chris Brennan, High Road Communications, 613 236-0909, cbrennan@highroad.com (ZL ZL.) prnewswire.com Copyright (C) 2002 PR Newswire. All rights reserved. | ||||||||||||||
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